Cold Form Blister Packaging Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecasts 2016–2024

Report Code: ZMR-439 | Report Format : | Status : Upcoming |

Abstract

Global Cold Form Blister Packaging Market: Overview

The blister pack is a kind of pre-formed plastic usually designed to pack pharmaceuticals, consumer goods, and food. This is made up of thermoformed plastic along with lid seal of aluminum foil. Blister packs are also known as clamshell due to its folds onto itself. Furthermore, blister packs protect from external environmental factors such as moisture, light, oxygen, and other gasses. It offers the highest rate of product virtue and forbearing consent.

Global Cold Form Blister Packaging Market: Growth Factors

Growing need for optimal safety and protection that enhance the shelf life of the product is anticipated to propel the demand in the global market. Increasing demand for cold form blister packaging from the pharmaceutical industry is the major driving factor expected to boost the cold form blister packaging market in the future. In addition, rising demand for cold form packs by various end-use industries fuels the global market growth. A government initiative to promote medical facilities may positively impact the cold form blister packaging market growth in future. Increasing disposable income and rising urbanization are anticipated to escalate market growth in future. Further, packaging materials are widely used to improve environmental standards; this, in turn, is expected to foster the growth of the global cold form blister packaging market in future.

Global Cold Form Blister Packaging Market: Segmentation

The global cold form blister packaging market is segmented on the basis of applications as electronics & semiconductors, healthcare, industrial goods, consumer products, food & beverages, and others. Of which, the healthcare application segment accounted for the highest market share. It heavily used cold forming packaging materials for packaging capsules, vials, drugs, syringes, tablets, ampoules, and so on. Some of these anti-counterfeit, senior-friendly, child-resistant, and tamper-evident packaging materials are high in demand globally. However, electronics & semiconductors are the second dominating application segment owing to rising demand for batteries, diodes, transmitters, transistors, and so on.

Global Cold Form Blister Packaging Market: Regional Analysis

Asia Pacific is anticipated to witness high growth mainly owing to rising demand in the healthcare industry. In addition, developing economies such as India and China are expected to witness high demand in electronics & semiconductors products. Growing adoption of sealed and protected products is accelerating the demand for cold form blister packaging.

Global Cold Form Blister Packaging Market: Competitive Players

Some of the major players in the global cold form blister packaging market are Honeywell International, Inc., Constantia Flexibles Group GmbH, Sonoco Co. products, Tekni-Plex Inc., Amcor Ltd., Essentra PLC, and Bemis Company Ltd. Companies are adopting various strategies to enhance company share in the global market. For instance, Amcor introduced Formpack Ultra, a new cold form blister for pharmaceutical products. This material can be extended more than standard cold form solutions.

Global Cold Form Blister Packaging Market: Regional Segment Analysis

  • North America
    • U.S.
  • Europe
    • UK
    • France
    • Germany 
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • The Middle East and Africa

What Reports Provides

  • Full in-depth analysis of the parent market
  • Important changes in market dynamics
  • Segmentation details of the market
  • Former, on-going, and projected market analysis in terms of volume and value
  • Assessment of niche industry developments
  • Market share analysis
  • Key strategies of major players
  • Emerging segments and regional markets
  • Testimonials to companies in order to fortify their foothold in the market.

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