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Advanced Packaging Market - Global Industry Analysis

Advanced Packaging Market - By Type (3D Integrated Circuit Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Wafer Level Package, Fan Out Silicon In Package, Flip Chip, Wafer Level Chip Scale Package, and Others), By Industry Vertical (IT & Telecommunication, Consumer Electronics, Automotive & Transport, Industrial, Aerospace & Defense, Healthcare, and Others), and By Region - Global Industry Perspective, Comprehensive Analysis, and Forecast, 2019 – 2025

Published Date: 27-Mar-2020 Category: Technology & Media Report Format : PDF Pages: 110 Report Code: ZMR-3996 Status : Published

Global advanced packaging market was capitalized at USD 3715.78 million in 2019, and it is anticipated to attain USD 7677.29 million by the end of 2025, budding at a CAGR of 11% in the forecasted period.

Description

The global advanced packaging market value was estimated at 3,715.78 (USD Million) in 2019 and is projected to hit 7,677.29 (USD Million) by 2025 growing at a CAGR of 11% during the period from 2019 to 2025. The report offers valuation and analysis of the advanced packaging market on a global as well as regional level. The study offers a comprehensive assessment of the industry competition, restraints, revenue estimates, avenues, current & emerging trends, and industry-validated market information. The report offers historical data from 2016 to 2018 along with a forecast from 2019 to 2025 based on value (USD Million).

Introduction

Advanced packaging has brought a paradigm shift in the chip manufacturing sector and is anticipated to bring huge transformation semiconductor fabrication methods. Apart from this, foundries have benefited to a large extent due to the advanced packaging automation.

Market Growth Dynamics

Growing necessity for high performing chips in various consumer electronics devices is likely to assist the advanced packaging market growth gain momentum over the forecast timeline. Furthermore, humungous demand for 3D Integrated Circuitand 2.5D packaging in chips that are utilized in smartphones will foster the demand for the advanced packaging during the ensuing years. In addition to this, large-scale acceptance of next-gen semiconductor tool is predicted to scale up the use of myriad advanced packaging methods, thereby steering the industry trends.

Furthermore, the changing customer trends for new packaging technologies and continuous breakthroughs made by key players for electronic items is likely to generate huge market demand over the forthcoming years. Additionally, the flourishing IoT sector is expected to culminate into demand for semiconductor packaging. Apparently, rise in the demand for consumer wearable goods and home equipment will favorably influence the market growth over the period from 2019 to 2025.

Our study provides the breakthroughs witnessed in the industry and the competitive business strategies implemented by the market participants for expanding their business portfolio. Let us discuss a few of the strategic moves made by the reputed brands influencing the advanced packaging market surge.

Global Advanced Packaging Market

ACM Research Launches Ultra SFP Application Tool For Advanced Packaging Solutions

In a major breakthrough that can positively impact the advanced packaging business, in March 2020, ACM Research, Inc., a key dealer in water processing services for both advanced wafer level packaging & semiconductors, launched an Ultra SFP App platform for advanced packing applications. Furthermore, the Ultra SFP App is devised to resolve the problems pertaining to output caused as a result of through- silicon via methods along with fanning out wafer level packaging issues that hamper fanning out wafer level packaging procedures.

Asia Pacific To Contribute Massively Towards Overall Market Surge By 2025

The growth of the regional market during the forecast timeline is owing to huge end-user demand for advanced packaging in the countries like China and India.

Key players profiled in global advanced packaging market include International Business Machines Corporation (IBM), Amkor Technology, ASE Group, Precision Industries Co., Ltd., Qualcomm Technologies, Inc., STATS ChipPAC Pte. Ltd., Siliconware, SSS MicroTec AG., Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., and Taiwan Semiconductor Manufacturing Company.

The global advanced packaging market is segmented as follows:

By type

  • 3D Integrated Circuit
  • 2D Integrated Circuit
  • 2.5D Integrated Circuit
  • Wafer Level Chip Scale Package
  • Flip Chip
  • Fan Out Silicon in Package
  • Fan Out Wafer Lever Package
  • Others

By industry vertical

  • Consumer Electronics
  • Automotive & Transport
  • IT & Telecommunication
  • Industrial
  • Healthcare
  • Aerospace & Defense
  • Others

By Region

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

Table Of Content

  • Chapter 1. Preface
    • 1.1. Report Description and Scope
    • 1.2. Research Scope
    • 1.3. Research Methodology
      • 1.3.1. Market Research Process
      • 1.3.2. Market Research Methodology
  • Chapter ???????2. Executive Summary
    • 2.1. Advanced Packaging Market, 2016–2025 (USD Million)
    • 2.2. Advanced Packaging Market: Snapshot
  • Chapter 3. Global Advanced Packaging Market– Industry Analysis
    • 3.1. Advanced Packaging Market: Market Dynamics
    • 3.2. Market Drivers
      • 3.2.1. Huge necessity of high performing chips in various consumer electronics equipment will steer business growth
      • 3.2.2. Humungous demand for 3D and 2.5D packaging in chips that are utilized in smartphones will foster product penetration
    • 3.3. Porter’s Five Forces Analysis
    • 3.4. Market Attractiveness Analysis
      • 3.4.1. Market attractiveness analysis By Type
      • 3.4.2. Market attractiveness analysis By Industry Vertical
  • Chapter 4. Global Advanced Packaging Market– Competitive Landscape
    • 4.1. Company market share analysis
      • 4.1.1. Global Advanced Packaging Market: company market share, 2018
    • 4.2. Strategic development
      • 4.2.1. Acquisitions & mergers
      • 4.2.2. New Product launches
      • 4.2.3. Agreements, partnerships, cullaborations, and joint ventures
      • 4.2.4. Research and development and Regional expansion
    • 4.3. Price trend analysis
  • Chapter 5. Global Advanced Packaging Market–Type Analysis
    • 5.1. Global Advanced Packaging Market overview: By Type
      • 5.1.1. Global Advanced Packaging Market share, By Type,2018 and 2025
    • 5.2. 3D Integrated Circuit
      • 5.2.1. Global Advanced Packaging Market by 3D Integrated Circuit, 2016–2025 (USD Million)
    • 5.3. 2D Integrated Circuit
      • 5.3.1. Global Advanced Packaging Market by 2D Integrated Circuit, 2016–2025 (USD Million)
    • 5.4. Fan Out Wafer Level Package
      • 5.4.1. Global Advanced Packaging Market by Fan Out Wafer Level Package, 2016–2025 (USD Million)
    • 5.5. Fan Out Silicon In Package
      • 5.5.1. Global Advanced Packaging Market by Fan Out Silicon In Package, 2016–2025 (USD Million)
    • 5.6. Flip Chip
      • 5.6.1. Global Advanced Packaging Market by Flip Chip, 2016–2025 (USD Million)
    • 5.7. Wafer Level Chip Scale Package
      • 5.7.1. Global Advanced Packaging Market by Wafer Level Chip Scale Package, 2016–2025 (USD Million)
    • 5.8. Others
      • 5.8.1. Global Advanced Packaging Market by Others, 2016–2025 (USD Million)
  • Chapter 6. Global Advanced Packaging Market– Industry Vertical Analysis
    • 6.1. Global Advanced Packaging Market overview: By Industry Vertical
      • 6.1.1. Global Advanced Packaging Market share, By Industry Vertical, 2018 and 2025
    • 6.2. IT & Telecommunication
      • 6.2.1. Global Advanced Packaging Market By IT & Telecommunication 2016–2025 (USD Million)
    • 6.3. Consumer Electronics
      • 6.3.1. Global Advanced Packaging Market By Consumer Electronics, 2016–2025 (USD Million)
    • 6.4. Industrial
      • 6.4.1. Global Advanced Packaging Market By Industrial, 2016–2025 (USD Million)
    • 6.5. Aerospace & Defense
      • 6.5.1. Global Advanced Packaging Market By Aerospace & Defense, 2016–2025 (USD Million)
    • 6.6. Healthcare
      • 6.6.1. Global Advanced Packaging Market By Healthcare, 2016–2025 (USD Million)
    • 6.7. Others
      • 6.7.1. Global Advanced Packaging Market By Others, 2016–2025 (USD Million)
  • Chapter 7. Company Profiles
    • 7.1. International Business Machines Corporation (IBM)
      • 7.1.1. Overview
      • 7.1.2. Financials
      • 7.1.3. Product Portfolio
      • 7.1.4. Business Strategy
      • 7.1.5. Recent Developments
    • 7.2. Amkor Technology
      • 7.2.1. Overview
      • 7.2.2. Financials
      • 7.2.3. Product Portfolio
      • 7.2.4. Business Strategy
      • 7.2.5. Recent Developments
    • 7.3. ASE Group
      • 7.3.1. Overview
      • 7.3.2. Financials
      • 7.3.3. Product Portfolio
      • 7.3.4. Business Strategy
      • 7.3.5. Recent Developments
    • 7.4. Precision Industries Co., Ltd.
      • 7.4.1. Overview
      • 7.4.2. Financials
      • 7.4.3. Product Portfolio
      • 7.4.4. Business Strategy
      • 7.4.5. Recent Developments
    • 7.5. Qualcomm Technologies, Inc.
      • 7.5.1. Overview
      • 7.5.2. Financials
      • 7.5.3. Product Portfolio
      • 7.5.4. Business Strategy
      • 7.5.5. Recent Development
    • 7.6. STATS ChipPAC Pte. Ltd.
      • 7.6.1. Overview
      • 7.6.2. Financials
      • 7.6.3. Product Portfolio
      • 7.6.4. Business Strategy
      • 7.6.5. Recent Development
    • 7.7. Siliconware
      • 7.7.1. Overview
      • 7.7.2. Financials
      • 7.7.3. Product Portfolio
      • 7.7.4. Business Strategy
      • 7.7.5. Recent Development
    • 7.8. SSS MicroTec AG
      • 7.8.1. Overview
      • 7.8.2. Financials
      • 7.8.3. Product Portfolio
      • 7.8.4. Business Strategy
      • 7.8.5. Recent Development
    • 7.9. Intel Corporation
      • 7.9.1. Overview
      • 7.9.2. Financials
      • 7.9.3. Product Portfolio
      • 7.9.4. Business Strategy
      • 7.9.5. Recent Development
    • 7.10. Jiangsu Changjiang Electronics Technology Co. Ltd.
      • 7.10.1. Overview
      • 7.10.2. Financials
      • 7.10.3. Product Portfolio
      • 7.10.4. Business Strategy
      • 7.10.5. Recent Development
    • 7.11. Taiwan Semiconductor Manufacturing Company
      • 7.11.1. Overview
      • 7.11.2. Financials
      • 7.11.3. Product Portfolio
      • 7.11.4. Business Strategy
      • 7.11.5. Recent Development

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