Advanced Packaging Market - Global Industry Analysis
Advanced Packaging Market - By Type (3D Integrated Circuit Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Wafer Level Package, Fan Out Silicon In Package, Flip Chip, Wafer Level Chip Scale Package, and Others), By Industry Vertical (IT & Telecommunication, Consumer Electronics, Automotive & Transport, Industrial, Aerospace & Defense, Healthcare, and Others), and By Region - Global Industry Perspective, Comprehensive Analysis, and Forecast, 2019 – 2025
Published Date: 27-Mar-2020Technology & Media
Category: Report Format : PDF
Report Code: ZMR-3996
Status : Published
Global advanced packaging market was capitalized at USD 3715.78 million in 2019, and it is anticipated to attain USD 7677.29 million by the end of 2025, budding at a CAGR of 11% in the forecasted period.