Advanced Packaging Market

Advanced Packaging Market - By Type (3D Integrated Circuit Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Wafer Level Package, Fan Out Silicon In Package, Flip Chip, Wafer Level Chip Scale Package, and Others), By Industry Vertical (IT & Telecommunication, Consumer Electronics, Automotive & Transport, Industrial, Aerospace & Defense, Healthcare, and Others), and By Region - Global Industry Perspective, Comprehensive Analysis, and Forecast, 2019 – 2025

Category: Technology & Media Report Format : PDF Pages: 110 Report Code: ZMR-3996 Published Date: Mar-2020 Status : Published

Global advanced packaging market was capitalized at USD 3715.78 million in 2019, and it is anticipated to attain USD 7677.29 million by the end of 2025, budding at a CAGR of 11% in the forecasted period.

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