Semiconductor and IC Packaging Material Market By Type (Lead Frames, Bonding Wires, Ceramic Packages, Organic Substrates, and Others) and By Packaging Technology (DFN, GA, QFN, SOP, and Others): Global Industry Perspective, Comprehensive Analysis, And Forecast, 2018–2025

Global semiconductor and IC packaging material market expected to reach around USD 34.8 billion by 2025, at a CAGR approximately 4.6% between 2019 and 2025. The semiconductor and IC packaging material market will show significant growth in the future, owing to the growing integration of technology in the automobile industry.

07-Aug-2019 | Number of pages: 126 | Report Code: ZMR-440 | Report Format : | Status : Published

Analysis

The adoption of integrated circuits and semiconductors for various electronic devices is driving the demand for packaging material. Packaging safeguards circuits and components from external damages, impacts, and corrosion. The semiconductor and IC packaging material market will show significant growth in the future, owing to the rising demand for electronic devices. Growing R&D investments by numerous leading companies to develop better packaging materials and technologies is also driving the semiconductor and IC packaging material market. Moreover, the demand for commercial, industrial, and consumer electronics is surging, owing to rising digitalization across the world. Using advanced technology in industries has become a necessity, as it saves times and leads to better output. The integrated circuits and semiconductors usage ensures better performance and these are widely utilized in the electronics industry. Furthermore, the increasing population acts as a catalyst for this market along with the growing consumer spending on electronic devices and the latest gadgets. Additionally, the development of packaging material for mobile phones and other gadgets is growing, which is also contributing to this market. However, difficulty in implementing new technologies and latest packaging materials in small companies might slow down the market.

On the basis of type, organic substrates are anticipated to hold a sizable share of the semiconductor and IC packaging material market. This can be attributed to their increasing demand in the packaging industry as it is moving toward using less packaging materials. Thus, these substrates are replacing bonding wires and lead frames and increasingly gaining market shares. Moreover, organic substrates are flexible and have a wide range of applications, which is further expected to fuel this segment’s growth.

By packaging technology, the QFN (quad flat no leads) package shows the maximum market potential, as QFN connects ICs to the printed circuit boards without the need to drill any holes. It is a small-sized, thin profiled, lightweight package with a reduced lead inductance. It offers good electrical and thermal performance, due to its exposed copper die-pad technology, and eases PCB trace routing. Thus, the segment is likely to grow notably in the future in the semiconductor and IC packaging material market globally.

Europe is predicted to hold a considerable share of the semiconductor and IC packaging material market globally, owing to the presence of premium car companies. All these manufacturers equip their cars with advanced technologies like cruise control, automatic rain-sensing, automatic headlamps, hill ascend, different driving modes, and automatic parking, which require various sensors and integrated circuits. 

Some key players of the semiconductor and IC packaging material market globally are Amkor Technology, DuPont, Henkel, Honeywell, Toppan Printing, Hitachi Chemical, Kyocera Chemical, LG Chemical, Alent, BASF, Sumitomo Chemical, Toray Industries Corporation, Mitsui High-Tec, and Tanaka Holdings.


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