Semiconductor Bonding Market - Global Industry Analysis

Semiconductor Bonding Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2026

Category: Semiconductor & Electronics Report Format : PDF Report Code: ZMR-6697 Status : Upcoming

Description

Global Semiconductor Bonding Market: Overview

Semiconductors’ arrangements consist of atoms bonded together to form a homogeneous structure. In the bonding model, the structure of the material is homogeneous and virtually similar throughout. Semiconductor bonding is used in the making of several integrated circuits (ICs) and fabrication devices.

Report Scope:

Report Attribute Details
Base Year 2020
Historic Years 2016 - 2020
Forecast Years 2021 - 2028
Segments Covered By Product Type, By Application, and By End Use
Forecast Units Value (USD Billion), and Volume (Units)
Quantitative Units Revenue in USD million/billion and CAGR from 2021 to 2028
Regions Covered North America, Europe, Asia Pacific, Latin America, and Middle East & Africa, and Rest of World
Countries Covered U.S., Canada, Mexico, U.K., Germany, France, Italy, Spain, China, India, Japan, South Korea, Brazil, Argentina, GCC Countries, and South Africa, among others
Number of Companies Covered 10 companies with scope for including additional 15 companies upon request
Report Coverage Market growth drivers, restraints, opportunities, Porter’s five forces analysis, PEST analysis, value chain analysis, regulatory landscape, market attractiveness analysis by segments and region, company market share analysis, and COVID-19 impact analysis.
Customization Scope Avail customized purchase options to meet your exact research needs.

Global Semiconductor Bonding Market: Growth Factors

The global semiconductor bonding market is likely to grow significantly in the forthcoming years due to the growing demand for microelectromechanical systems (MEMS). However, the high adoption of stacked die technology in the advanced internet of things (IoT) devices is likely to further complement the market growth. Stacked die technology refers to the structure where one bare die is attached to another with the help of the semiconductor package. It helps in facilitating multiple functionalities by utilizing the same area on a substrate. Die stacking facilitates the high-end performance of electrical devices by generating signals quickly with the small distance routing of interconnection between circuits. The original equipment manufacturers (OEMs) in the semiconductor sector are highly concentrating on enhancing the advantages of the internet of things beyond connectivity. The internet of things technology and associated devices, including distribution control systems, smart beacons, smart meters, RFID tags, and sensors, are highly being used in several applications like connected logistics, smart mobility & transportation, smart retail, smart manufacturing building & home automation, and several others. The semiconductor bonding methods are highly adopted in internet of things devices in order to use minimum space and attach multi-stacked dies on the same. The surging requirement for thin wafers in the semiconductor sector is a vital factor influencing the growth of the wafer bonding. However, such technological advancements in wafers have significantly assisted in overcoming several traditional fabrication processes. However, such benefits, including ultra-high electrical performance with less power consumption, are highly enticing to the Chinese IC manufacturers who are looking to utilize and upgrade this technology. Currently, there is a high requirement for thin chips that facilitate high performance at low cost and operating voltage. The thin wafer technologies, including wafer bonding, are gaining immense popularity and thereby also encouraging the growth of the global semiconductor bonding market. Also, the growing preference for hybrid and electric vehicles is further expanding the scope of semiconductor bonding in the market. Such vehicles effectively reduce carbon emissions, and thereby governments of several countries are also supporting such substantial investment in the automotive sector. Also, ongoing trends like touch-free human-machine interfaces are massively transforming the automotive sector. Such transformations are likely to expand the scope of connected cars and thereby will exponentially fuel the growth of the global semiconductor bonding market. Furthermore, the advent of industry 4.0 and advanced technologies like artificial intelligence in the automotive sector significantly are encouraging new developments in the market. Also, the introduction of technologies like intelligent parking assistance systems, adaptive cruise control, advanced driver assistance systems, and others will complement the global semiconductor bonding market growth.

Global Semiconductor Bonding Market: Segmentation

The global semiconductor bonding market can be segmented into application, wafer bonding technology, bonding technology, process type, type, and region.

By application, the market can be segmented into 3D NAND, LED, CMOS image sensors, MEMS & sensors, RF devices, and others.

By wafer bonding technology, the market can be segmented into hybrid bonding, TCB wafer bonding, anodic wafer bonding, direct wafer bonding, and others.

By bonding technology, the market can be segmented into die bonding technology and others. The die bonding technology segment can further be bifurcated into hybrid bonding, flip-chip attachment, epoxy die bonding, and eutectic die bonding.

By type, the market can be segmented into flip-chip bonder, wafer bonder, and die bonder.

By process type, the market can be segmented into the wafer to wafer bonding, die to wafer bonding, and die to die bonding.

Global Semiconductor Bonding Market: Regional analysis

Asia Pacific accounts for the largest share in the global semiconductor bonding market due to the fast proliferating automotive sector in the region. Furthermore, the presence of prominent market leaders in the region will also accentuate the growth of the regional market. The growing support from the government to promote sustainable and environment-friendly solutions will also fuel the demand for semiconductor devices, including sensors and ICS.

North America is a fast-growing region in the global semiconductor bonding market due to the high demand for 3D semiconductor assembly and packaging solutions in the region. In addition, the growing number of companies is adopting advanced technologies like IoT and artificial intelligence, particularly in the automotive sector, thereby widening the scope of semiconductor bonding in the region.

Global Semiconductor Bonding Market: Competitive Players

Some of the significant players in the global semiconductor bonding market are Shibaura Mechatronics, SUSS MicroTech SE, Yamaha Motor Robotics Corporation Co., Fuji Corporation, Panasonic, Kulicke & Soffa, ASM Pacific Technology Ltd., and BE Semiconductor Industries NV.

Global Semiconductor Bonding Market: Regional Segment Analysis

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

What Reports Provides

  • Full in-depth analysis of the parent market
  • Important changes in market dynamics
  • Segmentation details of the market
  • Former, on-going, and projected market analysis in terms of volume and value
  • Assessment of niche industry developments
  • Market share analysis
  • Key strategies of major players
  • Emerging segments and regional markets
  • Testimonials to companies in order to fortify their foothold in the market.

Table Of Content

Choose License Type

Request the coronavirus impact analysis across industries and markets

FrequentlyAsked Questions

The global semiconductor bonding market is likely to grow significantly in the forthcoming years due to the growing demand for microelectromechanical systems (MEMS). However, the high adoption of stacked die technology in the advanced internet of things (IoT) devices is likely to further complement the growth.

 

Some of the significant players in the global semiconductor bonding market are Shibaura Mechatronics, SUSS MicroTech SE, Yamaha Motor Robotics Corporation Co., Fuji Corporation, Panasonic, Kulicke & Soffa, ASM Pacific Technology Ltd., and BE Semiconductor Industries NV.

 

Asia Pacific accounts for the largest share in the global semiconductor bonding market due to the fast proliferating automotive sector in the region. Furthermore, the presence of prominent market leaders in the region will also accentuate the growth of the regional market.

HappyClients

Office Address

Corporate Office

Zion Market Research 244 Fifth Avenue, Suite N202 New York, 10001, United States
Tel: +1 (844) 845-5245
USA/Canada Toll Free No.+1 (855) 465-4651

Asia Pacific Office

3rd Floor, Mrunal Paradise, Opp Maharaja Hotel, Pimple Gurav, Pune 411061, Maharashtra, India
Phone No 020-46277770

Contact #

US OFFICE NO +1 (844) 845-5245
US/CAN TOLL FREE +1 (855) 465-4651
Email: sales@zionmarketresearch.com

We Are On Social