Molded Interconnect Device (MID) Market by Process (Laser Direct Structuring, 2-Shot Molding, Film Techniques) by Product Type (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting, Others) by Industry Vertical (Telecommunications, Consumer Electronics, BFSI, Military & Aerospace, Industrial, Healthcare, Automotive, Others): Global Industry Perspective, Comprehensive Analysis and Forecast, 2020 – 2026

Published Date: 25-Mar-2021 Category: Technology & Media Report Format : PDF Pages: 110 Report Code: ZMR-6029 Status : Published

The MID market is set for a rapid growth over the forecast period. In terms of revenue, the global MID market accounted for USD 1,008.06 Million in 2019 and is expected to reach USD 2,794.41 Million by 2026, growing at a CAGR of 15.68%.

Description

The MID market is set for a rapid growth over the forecast period. In terms of revenue, the global MID market accounted for USD 1,008.06 Million in 2019 and is expected to reach USD 2,794.41 Million by 2026, growing at a CAGR of 15.68%.

Global Molded Interconnect Device (MID) Market: Overview

Molded interconnect devices (MIDs) are injection-molded thermoplastic substrates with conductive circuit patterns that combine mechanical and electrical functions. They are generally 3-dimensional, and a number of techniques can be used to apply the components and conductors. Although the technology has advanced significantly in recent years, especially with the advancement of light-temperature resins and the use of rapid prototyping techniques to produce pre-production examples, however, traditional planar printed circuit board technology will continue to meet the demands for multilayers, large component densities, and plated-through holes.

With the introduction of features such as soldering pads and plated through-hole vias, it has become increasingly popular for MID solutions to include other components such as antennas and sensor interfaces. Consumer electronics, telecommunications, automobile, and medical are key markets for MID technology. MIDs are widely used as integrated antennas in cellphones and other mobile devices such as laptops and netbooks.

Global Molded Interconnect Device (MID) Market

Global Molded Interconnect Device (MID) Market: Growth Factors

Today's portable electronic devices with various functions in a small package are in high demand. To satisfy the miniaturisation requirement, mechanical and electrical systems must be integrated into a single product, which can be easily accomplished using MID. It aids in the integration of circuitry, connectors, housing, and cables into a single component. In consumer electronics, there is a growing need for more electronic circuits to be integrated into smaller spaces. For example, a smartphone needs an antenna; rather than engineering a stand-alone antenna.
 

The two-shot molding segment dominates the industry, owing to its ability to improve the performance and aesthetics of rubber and plastic molding products. Moreover, the process needs only one machine cycle, which reduces manufacturing costs and deliver more products per process. Since the process ensures a strong connection between materials, it is widely used in automotive interior components and medical devices among others.

The growing demand for designing medical-grade components, tools, and equipment would increase the demand for two-shot molding processes, providing an advantage for the growth of the molded interconnect devices industry. In healthcare applications, the process can handle requirements such as medical cleanliness and complex designs.

To achieve a competitive advantage over other players, companies are implementing innovation and growth strategies in the molding processes. For instance, in January 2019, GW Plastics announced plans to expand its multi-shot molding capabilities in order to increase automation and meet the needs of healthcare OEMs.

Global Molded Interconnect Device (MID) Market: Segmentation

Injection molding, laser activation, and metallization are the three fundamental stages in Laser Direct Structure (LDS). LDS requires only a single thermoplastic material to create a MID, making the molding phase a one-shot operation. The fact that there is only one part, implies that the circuitry is produced on the plastic itself, which is one of the distinctive characteristics of LDS. Laser activation is the second stage in the LDS process. At this stage, a physiochemical reaction takes place, which laser etched the wiring pattern onto the part and sets it for metallization. To allow LDS to function properly, the part molded in phase one must be made of an LDS grade material. These products, which are available from most major plastics suppliers, are doped versions of standard plastics such as acrylonitrile-butadiene-styrene (ABS) or nylon.

Automotive applications held a significant market share in 2020 and is projected to expand at a rapid pace in the near future. The spike is due to the increasing use of molded interconnect devices in a variety of automotive applications such as steering wheel hubs, position sensors, lighting and brake sensors.

In automotive applications, these devices are used to lower the number of wirings and integrate the requisite circuitry, including housings and connectors, into a single piece. Because of these features, molded interconnect devices will be in high demand from automotive manufacturers looking to create compact devices at a lower cost.

The industry would benefit from increasing customer demand for more electronic features in vehicles. Major players in the automotive industry are launching a slew of new safety and entertainment features in order to provide comfort and meet market demand. According to the OICA (International Organization of Motor Vehicle Manufacturers), automobile production in 2018 increased by 5.2% in Brazil, 8.0% in India,13.9% and 67.7% in Russia and Portugal respectively.

Global Molded Interconnect Device (MID) Market: Regional Analysis

By Geography, the MID market is segmented into North America, Europe, Latin America, Asia Pacific, and Middle East and Africa.

The Asia Pacific molded interconnect devices market will develop at a rapid pace in the near future. This is due to the increasing consumer electronics industry in India and China, which has an ample supply of raw materials and a large pool of cheap labour. This has encouraged many leaders in the consumer electronics industry to increase their presence in the region. Technology companies are focusing on providing more secure and lightweight portable electronic devices, generating massive business opportunities for market participants. In addition, many government measures to broaden the manufacturing sector would benefit the industry.

Global Molded Interconnect Device (MID) Market: Competitive Players

The major players in the global MID market include Molex, TE Connectivity, LPKF, HARTING, JOHNAN, APC, MID Solutions, Multiple Dimensions, and 2E mechatronic among others.

The report segment of global MID market are as follows:

Global Molded Interconnect Device (MID) Market: Process Segment Analysis

  • Laser Direct Structuring
  • 2-Shot Molding
  • Film Techniques

Global Molded Interconnect Device (MID) Market: Product Type Segment Analysis

  • Antennae & Connectivity Modules
  • Connectors & Switches
  • Sensors
  • Lighting
  • Others

Global Molded Interconnect Device (MID) Market: Industry Vertical Segment Analysis

  • Telecommunications
  • Consumer Electronics
  • BFSI
  • Military & Aerospace
  • Industrial
  • Healthcare
  • Automotive
  • Others

Global Molded Interconnect Device (MID) Market: Regional Segment Analysis

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

Table Of Content

  • Chapter 1. Preface
    • 1.1. Report Description
      • 1.1.1. Objective
      • 1.1.2. Target Audience
      • 1.1.3. Unique Selling Proposition (USP) & Offerings
    • 1.2. Research Scope
    • 1.3. Research Methodulogy
      • 1.3.1. Market Research Process
      • 1.3.2. Market Research Methodulogy
      • 1.3.3. Level 1: Primary Research
      • 1.3.4. Level 2: Secondary Research
      • 1.3.5. Level 3: Data Validation and Expert Panel Assessment Report Description and Scope
  • Chapter 2. Executive Summary
    • 2.1. Global Mulded Interconnect Device (MID) Market, 2016-2026, (USD Million)
    • 2.2. Mulded Interconnect Device (MID) Market: Market Snapshot
  • Chapter 3. Global Mulded Interconnect Device (MID) Market – Industry Analysis
    • 3.1. Introduction
    • 3.2. Industry Ecosystem Analysis
    • 3.3. Technulogy Landscape
    • 3.4. Market Drivers
      • 3.4.1. North America
      • 3.4.2. Europe
      • 3.4.3. Asia Pacific
      • 3.4.4. Latin America
      • 3.4.5. MEA
    • 3.5. Restraints
    • 3.6. Opportunity
    • 3.7. Innovation & Sustainability
    • 3.8. Regulatory Landscape
    • 3.9. Porter’s Five Forces Analysis
    • 3.10. PESTLE Analysis
    • 3.11. Mulded Interconnect Device (MID) Market: Market Attractiveness Analysis
      • 3.11.1. Market Attractiveness Analysis by Process Segment
      • 3.11.2. Market Attractiveness Analysis by Product Type Segment
      • 3.11.3. Market Attractiveness Analysis by Industry Vertical Segment
  • Chapter 4. Global Mulded Interconnect Device (MID) Market - Competitive Landscape
    • 4.1. Company Market Share Analysis, 2019
    • 4.2. Strategic Development
      • 4.2.1. Acquisitions and Mergers
      • 4.2.2. New Product Launch
      • 4.2.3. Agreements, Partnerships, Cullaborations and Joint Ventures
      • 4.2.4. Research & Development and Regional Expansion
  • Chapter 5. Mulded Interconnect Device (MID) Market – Process Segment Analysis
    • 5.1. Global Mulded Interconnect Device (MID) Market Revenue Share, by Process, 2019 & 2026 (USD Million)
    • 5.2. Global Mulded Interconnect Device (MID) Market by Laser Direct Structuring, 2016 – 2026 (USD Million)
    • 5.3. Global Mulded Interconnect Device (MID) Market by 2-Shot Mulding, 2016 – 2026 (USD Million)
    • 5.4. Global Mulded Interconnect Device (MID) Market by Film Techniques, 2016 – 2026 (USD Million)
  • Chapter 6. Mulded Interconnect Device (MID) Market – Product Type Segment Analysis
    • 6.1. Global Mulded Interconnect Device (MID) Market Revenue Share, by Product Type, 2019 & 2026 (USD Million)
    • 6.2. Global Mulded Interconnect Device (MID) Market by Antennae & Connectivity Modules, 2016 – 2026 (USD Million)
    • 6.3. Global Mulded Interconnect Device (MID) Market by Connectors & Switches, 2016 – 2026 (USD Million)
    • 6.4. Global Mulded Interconnect Device (MID) Market by Sensors, 2016 – 2026 (USD Million)
    • 6.5. Global Mulded Interconnect Device (MID) Market by Lighting, 2016 – 2026 (USD Million)
    • 6.6. Global Mulded Interconnect Device (MID) Market by Others, 2016 – 2026 (USD Million)
  • Chapter 7. Mulded Interconnect Device (MID) Market – Industry Vertical Segment Analysis
    • 7.1. Global Mulded Interconnect Device (MID) Market Revenue Share, by Industry Vertical, 2019 & 2026 (USD Million)
    • 7.2. Global Mulded Interconnect Device (MID) Market by Telecommunications, 2016 – 2026 (USD Million)
    • 7.3. Global Mulded Interconnect Device (MID) Market by Consumer Electronics, 2016 – 2026 (USD Million)
    • 7.4. Global Mulded Interconnect Device (MID) Market by BFSI, 2016 – 2026 (USD Million)
    • 7.5. Global Mulded Interconnect Device (MID) Market by Military & Aerospace, 2016 – 2026 (USD Million)
    • 7.6. Global Mulded Interconnect Device (MID) Market by Industrial, 2016 – 2026 (USD Million)
    • 7.7. Global Mulded Interconnect Device (MID) Market by Healthcare, 2016 – 2026 (USD Million)
    • 7.8. Global Mulded Interconnect Device (MID) Market by Automotive, 2016 – 2026 (USD Million)
    • 7.9. Global Mulded Interconnect Device (MID) Market by Others, 2016 – 2026 (USD Million)
  • Chapter 8. Mulded Interconnect Device (MID) Market – Regional Segment Analysis
    • 8.1. Global Mulded Interconnect Device (MID) Market: Regional Overview
      • 8.1.1. Global Mulded Interconnect Device (MID) Market Revenue Share, By Region, 2019 & 2026 (USD Million)
    • 8.2. North America
      • 8.2.1. North America Mulded Interconnect Device (MID) Market Revenue 2016 – 2026 (USD Million)
      • 8.2.2. North America Mulded Interconnect Device (MID) Market Revenue, By Process, 2016 – 2026 (USD Million)
      • 8.2.3. North America Mulded Interconnect Device (MID) Market Revenue, By Product Type, 2016 – 2026 (USD Million)
      • 8.2.4. North America Mulded Interconnect Device (MID) Market Revenue, By Industry Vertical, 2016 – 2026 (USD Million)
      • 8.2.5. U.S.
        • 8.2.5.1. U.S. Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.2.5.2. U.S. Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.2.5.3. U.S. Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.2.6. Canada
        • 8.2.6.1. Canada Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.2.6.2. Canada Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.2.6.3. Canada Education & Learning Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.2.7. Mexico
        • 8.2.7.1. Mexico Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.2.7.2. Mexico Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.2.7.3. Mexico Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
    • 8.3. Europe
      • 8.3.1. Europe Mulded Interconnect Device (MID) Market Revenue 2016 – 2026 (USD Million)
      • 8.3.2. Europe Mulded Interconnect Device (MID) Market Revenue, By Process, 2016 – 2026 (USD Million)
      • 8.3.3. Europe Mulded Interconnect Device (MID) Market Revenue, By Product Type, 2016 – 2026 (USD Million)
      • 8.3.4. Europe Mulded Interconnect Device (MID) Market Revenue, By Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.5. UK
        • 8.3.5.1. UK Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.5.2. UK Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.5.3. UK Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.6. France
        • 8.3.6.1. France Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.6.2. France Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.6.3. France Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.7. Germany
        • 8.3.7.1. Germany Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.7.2. Germany Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.7.3. Germany Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.8. Italy
        • 8.3.8.1. Italy Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.8.2. Italy Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.8.3. Italy Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.9. Spain
        • 8.3.9.1. Spain Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.9.2. Spain Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.9.3. Spain Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.10. Russia
        • 8.3.10.1. Russia Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.10.2. Russia Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.10.3. Russia Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.3.11. Rest of Europe
        • 8.3.11.1. Rest of Europe Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.3.11.2. Rest of Europe Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.3.11.3. Rest of Europe Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
    • 8.4. Asia Pacific
      • 8.4.1. Asia Pacific Mulded Interconnect Device (MID) Market Revenue 2016 – 2026 (USD Million)
      • 8.4.2. Asia Pacific Mulded Interconnect Device (MID) Market Revenue, By Process, 2016 – 2026 (USD Million)
      • 8.4.3. Asia Pacific Mulded Interconnect Device (MID) Market Revenue, By Product Type, 2016 – 2026 (USD Million)
      • 8.4.4. Asia Pacific Mulded Interconnect Device (MID) Market Revenue, By Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.5. China
        • 8.4.5.1. China Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.5.2. China Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.5.3. China Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.6. Japan
        • 8.4.6.1. Japan Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.6.2. Japan Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.6.3. Japan Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.7. India
        • 8.4.7.1. India Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.7.2. India Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.7.3. India Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.8. Australia
        • 8.4.8.1. Australia Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.8.2. Australia Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.8.3. Australia Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.9. South Korea
        • 8.4.9.1. South Korea Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.9.2. South Korea Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.9.3. South Korea Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.4.10. Rest of Asia Pacific
        • 8.4.10.1. Rest of Asia Pacific Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.4.10.2. Rest of Asia Pacific Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.4.10.3. Rest of Asia Pacific Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
    • 8.5. Latin America
      • 8.5.1. Latin America Mulded Interconnect Device (MID) Market Revenue 2016 – 2026 (USD Million)
      • 8.5.2. Latin America Mulded Interconnect Device (MID) Market Revenue, By Process, 2016 – 2026 (USD Million)
      • 8.5.3. Latin America Mulded Interconnect Device (MID) Market Revenue, By Product Type, 2016 – 2026 (USD Million)
      • 8.5.4. Latin America Mulded Interconnect Device (MID) Market Revenue, By Industry Vertical, 2016 – 2026 (USD Million)
      • 8.5.5. Brazil
        • 8.5.5.1. Brazil Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.5.5.2. Brazil Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.5.5.3. Brazil Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.5.6. Argentina
        • 8.5.6.1. Argentina Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.5.6.2. Argentina Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.5.6.3. Argentina Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.5.7. Rest of Latin America
        • 8.5.7.1. Rest of Latin America Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.5.7.2. Rest of Latin America Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.5.7.3. Rest of Latin America Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
    • 8.6. Middle East & Africa
      • 8.6.1. Middle East & Africa Mulded Interconnect Device (MID) Market Revenue 2016 – 2026 (USD Million)
      • 8.6.2. Middle East & Africa Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
      • 8.6.3. Middle East & Africa Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
      • 8.6.4. Middle East & Africa Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.6.5. GCC Countries
        • 8.6.5.1. GCC Countries Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.6.5.2. GCC Countries Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.6.5.3. GCC Countries Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.6.6. South Africa
        • 8.6.6.1. South Africa Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.6.6.2. South Africa Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.6.6.3. South Africa Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
      • 8.6.7. Rest of MEA
        • 8.6.7.1. Rest of MEA Mulded Interconnect Device (MID) Market Revenue, by Process, 2016 – 2026 (USD Million)
        • 8.6.7.2. Rest of MEA Mulded Interconnect Device (MID) Market Revenue, by Product Type, 2016 – 2026 (USD Million)
        • 8.6.7.3. Rest of MEA Mulded Interconnect Device (MID) Market Revenue, by Industry Vertical, 2016 – 2026 (USD Million)
  • Chapter 9. Company Profiles
    • 9.1. Mulex
      • 9.1.1. Overview
      • 9.1.2. Financials
      • 9.1.3. Product portfulio
      • 9.1.4. Business strategy
      • 9.1.5. Recent developments
    • 9.2. *Same information will be provided for below mentioned companies*
      • 9.2.1. TE Connectivity
      • 9.2.2. LPKF
      • 9.2.3. HARTING
      • 9.2.4. JOHNAN
      • 9.2.5. APC
      • 9.2.6. MID Sulutions
      • 9.2.7. Multiple Dimensions
      • 9.2.8. 2E mechatronic
      • 9.2.9. Others

Methodology


Frequently Asked Questions

Today's portable electronic devices with various functions in a small package are in high demand. To satisfy the miniaturisation requirement, mechanical and electrical systems must be integrated into a single product, which can be easily accomplished using MID. It aids in the integration of circuitry, connectors, housing, and cables into a single component. In consumer electronics, there is a growing need for more electronic circuits to be integrated into smaller spaces. For example, a smartphone needs an antenna; rather than engineering a stand-alone antenna. The two-shot molding segment dominates the industry, owing to its ability to improve the performance and aesthetics of rubber and plastic molding products. Moreover, the process needs only one machine cycle, which reduces manufacturing costs and deliver more products per process. Since the process ensures a strong connection between materials, it is widely used in automotive interior components and medical devices among others. These factors are expected to drive market growth.

According to Zion Market Research, the Molded Interconnect Device (MID) market is expected to generate revenue of around USD 2,794.41 Million by the end of 2026, growing at a CAGR of 15.68%.

The Asia Pacific molded interconnect devices market will develop at a rapid pace in the near future. This is due to the increasing consumer electronics industry in India and China, which has an ample supply of raw materials and a large pool of cheap labour. This has encouraged many leaders in the consumer electronics industry to increase their presence in the region. Technology companies are focusing on providing more secure and lightweight portable electronic devices, generating massive business opportunities for market participants. In addition, many government measures to broaden the manufacturing sector would benefit the industry.

The major players in the global MID market include Molex, TE Connectivity, LPKF, HARTING, JOHNAN, APC, MID Solutions, Multiple Dimensions, and 2E mechatronic among others.

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