Global Advanced Packaging Market To Grow At A CAGR Approximately 11% By The End Of 2025

27-Mar-2020 | Zion Market Research

As per analysts from Zion Market Research, the global advanced packaging market was capitalized at USD 3715.78 million in 2019, and it is anticipated to attain USD 7677.29 million by the end of 2025, budding at a CAGR of 11% in the forecasted period. The surge in demand for AI (artificial intelligence) will boom a huge demand for semiconductors with developments. The advanced packaging practices use an IC (integrated circuit), which is coated in a supporting case that avoids corrosion and physical damage of the metallic parts. This case is known as a package that holds electrical contacts linked to the device to a circuit board. The advanced packaging producers create different kinds of ICs as per the needs in the packaging. The kind of package utilized is based upon various parameters like field-operating conditions, size, power dissipation, and cost.

Some of the key companies in this market are Amkor Technology, ASE Group, STATS ChipPAC Pte. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co., Ltd., SSS MicroTec AG., Intel Corporation, Qualcomm Technologies, Inc., International Business Machines Corporation (IBM), and Taiwan Semiconductor Manufacturing Company.

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Improvements In Traditional Packaging To Boost The Global Advanced Packaging Market

The worldwide advanced packaging market is spurred by its advantages over traditional packaging technologies, looming need for size reduction across electronic devices, and less power intake. Nevertheless, the heating issue in devices limits the growth in the market. In addition, advancement in speculation of research & development activities and constant development of such technologies offer new opportunities for the contenders functional in the market. As the people are moving toward connected devices, amplification in the IoT (Internet of Things) will result in the development of semiconductor packaging. An augment in the requirement for consumer wearable goods, home appliances, and smartphones will serve as a positive aspect of this industry.

The global advanced packaging market is sectioned based on the type, industry vertical, and geography. By type, the market is divided into wafer level chip scale package, 2D integrated circuit, 2.5D integrated circuit, fan out wafer level package, 3D integrated circuit, fan out silicon in package, flip chip, and others. By industry vertical, the market is bifurcated into consumer electronics, aerospace & defense, transport & automotive, industrial, IT & telecommunication, healthcare, and others.

The Asia-Pacific Region To Record The Highest Development In The Global Advanced Packaging Market

Based on the geographical analysis, the global advanced packaging market is classified into Middle East & Africa, Asia Pacific, Europe, North America, and Latin America. Asia-Pacific is projected to develop at a healthy pace, being a chief revenue-generating region in the forecasted period, mainly due to the rising population and the customer-side demand. Well-known semiconductor producing companies present in the region are boosting the requirement for advanced semiconductor packaging.

Browse the full “Advanced Packaging Market - By Type (3D Integrated Circuit Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Wafer Level Package, Fan Out Silicon In Package, Flip Chip, Wafer Level Chip Scale Package, and Others), By Industry Vertical (IT & Telecommunication, Consumer Electronics, Automotive & Transport, Industrial, Aerospace & Defense, Healthcare, and Others), and By Region - Global Industry Perspective, Comprehensive Analysis, and Forecast, 2019 – 2025.” Report at https://www.zionmarketresearch.com/report/advanced-packaging-technologies-market

Global Advanced Packaging Market

The global advanced packaging market is segmented as follows:

By type:

  • 3D Integrated Circuit
  • 2D Integrated Circuit
  • 2.5D Integrated Circuit
  • Wafer Level Chip Scale Package
  • Flip Chip
  • Fan Out Silicon in Package
  • Fan Out Wafer Lever Package
  • Others

By industry vertical:

  • Consumer Electronics
  • Automotive & Transport
  • IT & Telecommunication
  • Industrial
  • Healthcare
  • Aerospace & Defense
  • Others

By region:

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

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