Radiation Hardened Electronics Market Size, Share Report, Analysis, Trends, Growth 2032

Radiation Hardened Electronics Market

Radiation Hardened Electronics Market By Component (Mixed Signal ICs, Power Management, Memory, and Processors & Controllers), By Product Type (Commercial Off-the-Shelf and Customized), By Manufacturing Method (RHBS, RHBD, and RHBP), and By Region - Global and Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, and Forecasts 2024 – 2032

Category: Semiconductor & Electronics Report Format : PDF Pages: 222 Report Code: ZMR-8242 Published Date: Apr-2024 Status : Published
Market Size in 2023 Market Forecast in 2032 CAGR (in %) Base Year
USD 1,845 million USD 3,127 million 6.04% 2023

 

Radiation Hardened Electronics Market

Radiation Hardened Electronics Industry Prospective:

The global radiation hardened electronics market size was evaluated at $1,845 million in 2023 and is slated to hit $3,127 million by the end of 2032 with a CAGR of nearly 6.04% between 2024 and 2032.  

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Radiation Hardened Electronics Market: Overview

Radiation causes various kinds of damage to electronic parts such as latch-up, total-dose effects, and single-event upsets. Moreover, single-event upsets take place when an ionizing particle strikes a sensitive area of an electronic part and alters its state. Additionally, latch-up takes place when its component is exposed to an ionizing particle and it becomes permanently conductive which causes a short circuit.

Apart from this, total dose effects take place when a component is affected as a result of high radiation throughout an elongated timespan and its performance is severely affected. Furthermore, radiation hardened electronics are devised to reduce these effects by making use of materials that are less prone to damage to electronic parts as a result of radiation exposure.

Key Insights

  • As per the analysis shared by our research analyst, the global radiation hardened electronics market is projected to expand annually at the annual growth rate of around 6.04% over the forecast timespan (2024-2032)
  • In terms of revenue, the global radiation hardened electronics market size was evaluated at nearly $1,845 million in 2023 and is expected to reach $3,127 million by 2032.
  • The global radiation hardened electronics market is anticipated to grow rapidly over the forecast timeline owing to a surge in the use of commercial satellites across the globe.
  • In terms of component, the processors & controllers segment is slated to register the highest CAGR over the forecast period.
  • Based on product type, the commercial off-the-shelf segment is predicted to contribute majorly towards the global industry share in the upcoming years.
  • Based on the manufacturing method, the RHBP segment is predicted to dominate the segmental space in the ensuing years.
  • Region-wise, the North American radiation hardened electronics industry is projected to register the fastest CAGR during the projected timespan.

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Radiation Hardened Electronics Market: Growth Factors

A rise in the utilization of commercial satellites to boost the global market trends over 2024-2032

A surge in the use of commercial satellites is predicted to foster the global radiation hardened electronics market expansion. An increment in reconnaissance, intelligence, and surveillance activities is likely to catapult the global market profitability in the years to come. A rise in the allocation of funds for space exploration activities will proliferate the size of the global market over the forecast timespan.

With firms in the space & telecom sector investing notably in improving the 5G satellite communications network infrastructure, the market for radiation hardened electronics is likely to expand leaps & bounds in the foreseeable future.

Radiation Hardened Electronics Market: Restraints

Suring prices of producing the product can hinder the global industry expansion by 2032

Difficulties in the creation of a real testing environment can put brakes on the global radiation hardened electronics industry expansion over the forecast period. Moreover, escalating costs of developing radiation hardened electronics will restrict the growth of the global industry.

Radiation Hardened Electronics Market: Opportunities

An increase in the number of nuclear power establishments can open new growth avenues for the global market

A surge in the number of nuclear power units across the globe will offer new growth opportunities for the global radiation hardened electronics market in the years ahead.

Radiation Hardened Electronics Market: Challenges

Growing requirements of premium customers can challenge the expansion of the global industry by 2032

Personal needs of high-end customers can prove to be a huge challenge for the growth of the global radiation hardened electronics industry.

Radiation Hardened Electronics Market: Segmentation

The global radiation hardened electronics market is divided into component, product type, manufacturing method, and region.                                         

In component terms, the radiation hardened electronics market across the globe is bifurcated into mixed signal ICs, power management, memory, and processors & controllers segments. Additionally, the processors & controllers segment, which acquired nearly 54% of the global market earnings in 2023, is expected to register the fastest annual rate of growth in the forecast timespan. The expansion of the segment in the next eight years can be a result of the large-scale use of processors & controllers as synchronizing, controlling, and directing components for ensuring the proper functioning of space missions.

Based on the product type, the global radiation hardened electronics industry is divided into commercial off-the-shelf and customized segments. Moreover, the commercial off-the-shelf segment, which accumulated about 56% of the global industry earnings in 2023, is anticipated to make massive contributions towards the global industry proceeds over the analysis timeline. The growth of the segment in the forthcoming years can be owing to the massive adoption of commercial off-the-shelf radiation hardened electronics in commercial small satellites as well as military satellites.

On the basis of manufacturing method, the radiation hardened electronics market is sectored into RHBS, RHBD, and RHBP segments. Furthermore, the RHBP segment, which garnered nearly 65% of the global market size in 2023, is projected to dominate the segmental space in the upcoming years. The growth of the segment can be due to the large-scale use of the RHBP method of product manufacture as it makes use of IC fabrication & modifications for hardening electronic parts. Moreover, the RHBP manufacturing method can handle radiation head-on through transistor body creation that is not so sensitive to the degradation effects of radiation on hardened electronic components.

Radiation Hardened Electronics Market: Report Scope

Report Attributes Report Details
Report Name Radiation Hardened Electronics Market
Market Size in 2023 USD 1,845 Million
Market Forecast in 2032 USD 3,127 Million
Growth Rate CAGR of 6.04%
Number of Pages 222
Key Companies Covered Renesas Electronics Corporation, Honeywell International Inc., STMicroelectronics, Texas Instruments Incorporated, BAE Systems, Data Device Corporation, Ridgetop Group Inc., Microchip Technology Inc., Microsemi, MAXWELL TECHNOLOGIES INC., Infineon Technologies AG, Cobham Limited, Teledyne Technologies Inc., Xilinx Inc., Analog Devices Inc., Boeing, TT Electronics, VORAGO Technologies, VPT Inc., and others.
Segments Covered By Component, By Product Type, By Manufacturing Method, and By Region
Regions Covered North America, Europe, Asia Pacific (APAC), Latin America, Middle East, and Africa (MEA)
Base Year 2023
Historical Year 2018 to 2022
Forecast Year 2024 - 2032
Customization Scope Avail customized purchase options to meet your exact research needs. Request For Customization

Radiation Hardened Electronics Market: Regional Insights

Asia-Pacific is expected to maintain the in the global market domination in the forecasting years

Asia-Pacific, which garnered nearly 33% of the global radiation hardened electronics market earnings in 2023, is slated to establish leadership in the global market in the years ahead. In addition to this, the regional market expansion in the next couple of years can be subject to tremendous growth in space exploration activities made by countries such as India and China in recent years. These activities include lunar exploration, satellite navigation, and communication satellites as well as the sending of unmanned & manned satellites in space to gain knowledge of the space environment.

The North American radiation hardened electronics industry is anticipated to register the fastest growth rate annually during the forecast timespan. The rapid progression of the industry in North America can be ascribed to a rise in the use of innovative systems and tiny components by various firms in countries such as the U.S. Thriving space tourism activities will contribute substantially towards the growth of the industry in the region.     

Key Developments

  • In the first half of 2023, Microchip introduced VSC8574RT PHY, an extension of the radiation-tolerant group of gigabit Ethernet PHYs. The move will boost the expansion of the radiation hardened electronics business across the globe.

Radiation Hardened Electronics Market: Competitive Space

The global radiation hardened electronics market profiles key players such as:

  • Renesas Electronics Corporation
  • Honeywell International Inc.
  • STMicroelectronics
  • Texas Instruments Incorporated
  • BAE Systems
  • Data Device Corporation
  • Ridgetop Group Inc.
  • Microchip Technology Inc.
  • Microsemi
  • MAXWELL TECHNOLOGIES INC.
  • Infineon Technologies AG
  • Cobham Limited
  • Teledyne Technologies Inc.
  • Xilinx Inc.
  • Analog Devices Inc.
  • Boeing
  • TT Electronics
  • VORAGO Technologies
  • VPT Inc.

The global radiation hardened electronics market is segmented as follows:

By Component

  • Mixed Signal ICs
  • Memory
  • Processors & Controllers

By Product Type

  • Commercial Off-the-Shelf
  • Customized

By Manufacturing Method

  • RHBS
  • RHBD
  • RHBP

By Region

  • North America
    • The U.S.
    • Canada
  • Europe
    • France 
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

Table Of Content

Methodology

FrequentlyAsked Questions

Radiations hardened electronics are devised for reducing the effects of radiations on components of electronic parts by making use of materials that are less prone to damaging electronics parts as a result of exposure to radiations.

The global radiation hardened electronics market growth over forecast period can be owing to an increment in the reconnaissance, intelligence, and surveillance activities.

According to a study, the global radiation hardened electronics industry size was $1,845 million in 2023 and is projected to reach $3,127 million by the end of 2032.

The global radiation hardened electronics market is anticipated to record a CAGR of nearly 6.04% from 2024 to 2032.

The North American radiation hardened electronics industry is set to register the fastest CAGR over the forecasting timeline owing to a rise in the use of innovative systems and tiny components by various firms in the countries such as the U.S. Thriving space tourism activities will contribute substantially towards the growth of the industry in the region.

The global radiation hardened electronics market is led by players such as Renesas Electronics Corporation, Honeywell International Inc., STMicroelectronics, Texas Instruments Incorporated, BAE Systems, Data Device Corporation, Ridgetop Group, Inc.,  Microchip Technology Inc., Microsemi, MAXWELL TECHNOLOGIES, INC., Infineon Technologies AG, Cobham Limited, Teledyne Technologies Inc., Xilinx, Inc., Analog Devices, Inc., Boeing, TT Electronics, VORAGO Technologies, and VPT, Inc.  

The global radiation hardened electronics market report covers the geographical market along with a comprehensive competitive landscape analysis. It also includes cash flow analysis, profit ratio analysis, market basket analysis, market attractiveness analysis, sentiment analysis, PESTEL analysis, trend analysis, SWOT analysis, trade area analysis, demand & supply analysis, Porter’s five force analysis, and value chain analysis.

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