Die Attach Machine Market - Global Industry Analysis

Die Attach Machine Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2026

Category: Heavy Industry Report Format : PDF Report Code: ZMR-5618 Status : Upcoming

Description

Global Die Attach Machine Market: Overview

Die attach machines are used for the process of die attaching or die bonding. The process of attaching a semiconductor chip or die to another die, package, or substrate is known as die attach or die bonding. The process ranges from fundamental to multiple forms of packaging. The four common processes of die attach such as adhesive bonding, eutectic bonding, solder attach, and flip-chip provide different properties of bond and use different materials or distinct procedures of the workflow. Die attach machines vary significantly based on their cost, function, size, performance, reliability, the expectancy of product life, and hermeticity.

Global Die Attach Machine Market: Growth Factors

Growing demand for electronic devices, strict rules imposed by the government for the safety of workers at the workplace, and rising focus of the manufacturers to increase the production capacity & reduce the operational time are some of the major factors that are spurring the growth of the global die attach machine market. The electronics and semiconductors industry are making innovations and progress at a rapid pace. Also, there is an expanding use of hybrid circuits in photonics, medical, wireless electronics, and military applications. In addition to this, die bonders are continuously improving in terms of accuracy and speed. To meet the business demands, the end-users are scaling up the capacity of manufacturing which is been driven by advanced optical sensors, telecommunication upgrades, and data center applications. Owing to such growing demand there is a need for die attach machines which in turn is boosting the growth of the global market. Moreover, growing penetration of LEDs, initiatives undertaken by the government to develop smart cities that require electronic solutions for monitoring, maintenance, & surveillance purposes, and an increase in demand for miniature electronic devices are some of the key features that are fuelling the growth of the market. Furthermore, with the development in artificial intelligence and IoT, there will be a huge demand for manufactures of memory chips which will lead to the growth of the global die attach machine market during the forecast period. However, the high cost of the die attach machines may hamper the growth of the global die attach machine market.

Initially, due to the Covid-19 pandemic, there was a drop in the demand for die attach machine. The restriction on transport and personnel movement led to the disruption of the supply chain which ultimately hampered the manufacturing processes in several industries including the electronics and semiconductor industry. However, from the second quarter of the year 2020, to address coronavirus, the demand for the manufacture of critical semiconductor components increased. Moreover, in medical devices, the demand for pressure sensors, one of the important components of the ventilators and respirators increased substantially due to the rise in the number of Covid-19 patients. Thus, the global die attach machine market experienced a steady growth amid the Covid-19 pandemic.

Report Attribute Details
Base Year 2020
Historic Years 2016 - 2020
Forecast Years 2021 - 2028
Segments Covered By Product Type, By Application, and By End Use
Forecast Units Value (USD Billion), and Volume (Units)
Quantitative Units Revenue in USD million/billion and CAGR from 2021 to 2028
Regions Covered North America, Europe, Asia Pacific, Latin America, and Middle East & Africa, and Rest of World
Countries Covered U.S., Canada, Mexico, U.K., Germany, France, Italy, Spain, China, India, Japan, South Korea, Brazil, Argentina, GCC Countries, and South Africa, among others
Number of Companies Covered 10 companies with scope for including additional 15 companies upon request
Report Coverage Market growth drivers, restraints, opportunities, Porter’s five forces analysis, PEST analysis, value chain analysis, regulatory landscape, market attractiveness analysis by segments and region, company market share analysis, and COVID-19 impact analysis.
Customization Scope Avail customized purchase options to meet your exact research needs.

Global Die Attach Machine Market: Segmentation

The global die attach machine market is classified based on technique, type, application, and region. Based on the technique, the global market is divided into eutectic, hybrid bonding, epoxy, soft solder, and others. The type segment is bifurcated into flip chip bonder and die bonder. Based on the application, the global die attach machine market is categorized into RF & MEMS, optoelectronics/photonics, logic, memory, CMOS image sensors, LED, and others.

Global Die Attach Machine Market: Regional Analysis

North America is estimated to hold the largest share in the global die attach machine market and is projected to maintain the dominant position during the forecast period. This is attributed to the presence of major key players with state of the art infrastructures as well as the huge production of electronic devices in this region. However, the global die attach machine market in Asia Pacific region is anticipated to grow with the highest CAGR. Factors such as the growing number of integrated device manufacturers and the increase in the need for healthcare services, especially in medical devices, are contributing to the growth of the global market in this region.

Global Die Attach Machine Market: Competitive Players

ASM Pacific Technology Limited, Fasford Technology Co Ltd., MicroAssembly Technologies, Ltd., Anza Technology Inc., Dr. Tresky AG, Palomar Technologies, Inc., Be Semiconductor Industries N.V., Kulicke and Soffa Industries, Inc., Shinkawa Ltd., and Inseto UK Limited are some of the key players operating in the global die attach machine market.

Global Die Attach Machine Market: Regional Segment Analysis

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

What Reports Provides

  • Full in-depth analysis of the parent market
  • Important changes in market dynamics
  • Segmentation details of the market
  • Former, on-going, and projected market analysis in terms of volume and value
  • Assessment of niche industry developments
  • Market share analysis
  • Key strategies of major players
  • Emerging segments and regional markets
  • Testimonials to companies in order to fortify their foothold in the market.

Table Of Content


Frequently Asked Questions

Growing demand for electronic devices, strict rules imposed by the government for the safety of workers at the workplace, and rising focus of the manufacturers to increase the production capacity & reduce the operational time are some of the major factors that are spurring the growth of the global die attach machine market. Furthermore, with the development in artificial intelligence and IoT, there will be a huge demand for manufactures of memory chips which will lead to the growth of the global die attach machine market during the forecast period.

ASM Pacific Technology Limited, Fasford Technology Co Ltd., MicroAssembly Technologies, Ltd., Anza Technology Inc., Dr. Tresky AG, Palomar Technologies, Inc., Be Semiconductor Industries N.V., Kulicke and Soffa Industries, Inc., Shinkawa Ltd., and Inseto UK Limited are some of the key players operating in the global die attach machine market.

North America is estimated to hold the largest share in the global die attach machine market and is projected to maintain the dominant position during the forecast period. This is attributed to the presence of major key players with state of the art infrastructures as well as the huge production of electronic devices in this region.

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