Embedded Die Packaging Market - Global Industry Analysis

Embedded Die Packaging Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2026

Category: Packaging Report Format : PDF Report Code: ZMR-5943 Status : Upcoming

Description

Global Embedded Die Packaging Market: Overview

Embedded die technology embeds the die directly into a printed circuit board that laminates substrate. The technology is adopted in the manufacturing process and it facilitates numerous benefits like power-saving, size reduction, and enhancement of overall system efficiency with a wide scope. However, it also improves thermal and electrical performance, heterogeneous integration, cost reduction, miniaturization, and efficient logistics for OEM. It facilitates the flexible integration system coupled with high robustness, better reliability, and fast turnaround of the package.

Report Scope:

Report Attribute Details
Base Year 2020
Historic Years 2016 - 2020
Forecast Years 2021 - 2028
Segments Covered By Product Type, By Application, and By End Use
Forecast Units Value (USD Billion), and Volume (Units)
Quantitative Units Revenue in USD million/billion and CAGR from 2021 to 2028
Regions Covered North America, Europe, Asia Pacific, Latin America, and Middle East & Africa, and Rest of World
Countries Covered U.S., Canada, Mexico, U.K., Germany, France, Italy, Spain, China, India, Japan, South Korea, Brazil, Argentina, GCC Countries, and South Africa, among others
Number of Companies Covered 10 companies with scope for including additional 15 companies upon request
Report Coverage Market growth drivers, restraints, opportunities, Porter’s five forces analysis, PEST analysis, value chain analysis, regulatory landscape, market attractiveness analysis by segments and region, company market share analysis, and COVID-19 impact analysis.
Customization Scope Avail customized purchase options to meet your exact research needs.

Global Embedded Die Packaging Market: Growth Factors

One of the major factors driving the global embedded die packaging market is the outbreak of COVID-19. The pandemic has boosted the work from home and data centers policies which in turn have fueled the demand for large storage capacities in smart devices and laptops. This boost in the semiconductor sector has propelled the growth of the global embedded die packaging market. The surging demand from the aerospace and defense sectors for the utilization of embedded die packaging in military communication applications has significantly propelled the growth of the global embedded die packaging market. Moreover, the rising disposable income of people across the globe has created a huge demand for consumer electronic products like refrigerators, computers, speakers, displays, monitors, televisions, tablets, smartphones, and several other electrical products that need semiconductor assembly. Moreover, the advancements and developments in technology along with growing competition in the sector are likely to create a positive trajectory for the global embedded die packaging market during the forecast period. The increasing adoption of IoT across the globe is creating lucrative opportunities in the global embedded die packaging market. The growing advancements in the healthcare sectors coupled with the surging adoption of electronic devices have fueled the demand for embedded die packaging significantly. The growing demand for high-performance computing is also bolstering the growth of the global embedded die packaging market. Increasing demand for portable devices like headphones also fuels the growth of the market.

Global Embedded Die Packaging Market: Segmentation

The global embedded die packaging market can be segmented into application, platform, industry verticals, and region.

By application, the market can be segmented into security technologies, industrial sensing, medical implants & wearables devices, fitness & sports devices, and others.

By platform, the market can be segmented into embedded die in the flexible board, embedded die in the rigid board, and IC package substrate. The embedded die in the IC package substrate segment holds hegemony over others due to the increasing adoption of DC-DC convertors along with the camera modules utilized in smartphones.

By industry vertical, the market can be segmented into healthcare, automotive, IT & telecommunication, consumer electronics, and others. The consumer electronics segment accounts for the largest share in the global embedded die packaging market owing to the surging demand for miniaturization coupled with the high adoption of such packaging technology for numerous smartphone devices.

Global Embedded Die Packaging Market: Regional analysis

North America accounts for the largest share in the global embedded die packaging market due to the highly developed telecommunication sector. Moreover, the growing adoption of IoT along with rapidly proliferating automobile sectors is contributing vigorously to the growth of the regional market.

Asia Pacific is anticipated to grow significantly during the forecast period due to the surging adoption of consumer electronics owing to the increasing disposable income of the people in the region. Moreover, the presence of prominent market players in the region also boosts the growth of the regional market.

Global Embedded Die Packaging Market: Competitive Players

Some of the prominent companies in the global embedded die packaging market are Schweizer, TDK-Epcos, Microsemi, Fujikura, Infineon Technologies AG, General Electric, ASE Group, Taiwan Semiconductor Manufacturing Company, Amkor Technology, SHINKO ELECTRIC INDUSTRIES CO., LTD., Advanced Semiconductor Engineering, Inc., Austria Technologies & Systemtechnik Aktiengesellschaft, Toshiba Corporation, Texas Instruments Incorporation, and Microsemi Corporation.

Global Embedded Die Packaging Market: Regional Segment Analysis

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

What Reports Provides

  • Full in-depth analysis of the parent market
  • Important changes in market dynamics
  • Segmentation details of the market
  • Former, on-going, and projected market analysis in terms of volume and value
  • Assessment of niche industry developments
  • Market share analysis
  • Key strategies of major players
  • Emerging segments and regional markets
  • Testimonials to companies in order to fortify their foothold in the market.

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FrequentlyAsked Questions

One of the major factors driving the global embedded die packaging market is the outbreak of COVID-19. The pandemic has boosted the work from home and data centers policies which in turn have fueled the demand for large storage capacities in smart devices and laptops. This boost in the semiconductor sector has propelled the growth of the global embedded die packaging market.

Some of the prominent market players in the global embedded die packaging market are Schweizer, TDK-Epcos, Microsemi, Fujikura, Infineon Technologies AG, General Electric, AT & S, ASE Group, Taiwan Semiconductor Manufacturing Company, Amkor Technology, and SHINKO ELECTRIC INDUSTRIES CO.

North America accounts for the largest share in the global embedded die packaging market due to the highly developed telecommunication sector. Moreover, the growing adoption of IoT along with rapidly proliferating automobile sectors is contributing vigorously to the growth of the regional market.

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