3D IC Market - Global Industry Analysis

3D IC Market By Type Segment Analysis (LED, Memories, MEMS, Sensor, Logic, Others), By Substrate Segment Analysis (Silicon on Insulator (SOI), Bulk Silicon), By Application Type Segment Analysis (Information and Communication Technology, Military, Consumer Electronics, Others): Global Industry Perspective, Comprehensive Analysis and Forecast, 2020 – 2028

Published Date: 19-May-2021 Category: Technology & Media Report Format : PDF Pages: 150 Report Code: ZMR-1323 Status : Published

Global 3D Printing Gases Market accounted for USD 9.76 Billion in 2020 and is expected to reach USD 23.80 Billion by 2028, growing at a CAGR of 20.45% from 2021 to 2028.

Description

Market Overview

Global 3D Printing Gases Market accounted for USD 9.76 Billion in 2020 and is expected to reach USD 23.80 Billion by 2028, growing at a CAGR of 20.45% from 2021 to 2028.

A three-dimensional integrated circuit is nothing but a MOS integrated circuit produced with the help of stacking silicon wafers or dies and linking them up vertically. Owing to the increase in the varying microelectronics industry, there is a notable development in the market trend for integrated circuits (ICs). It is recognized as the most viable solution for its impeccable contribution to overall performance, risen functionality and its ability to use power cost-effectively. The market is about to witness an upward trend in the fields of medical and consumer electronics industries, military & aerospace, etc. 

There has been an increase in the investment in research and development activities, due to its varying end-user applications, for 3D ICs are anticipated to expect market growth in the forthcoming years. Moreover, the growth of the market is taken over by the expanding demand for advanced electronic products with extraordinary functionality and efficient performance and not to forget the spike in demand for 3D packaging deploying TSVs. Many key players across the market are working together to address surging demand for connecting several products such as home appliances, smart homes and sensors with a prevailing interacting standard. This cannot be possible without the virtual stack of 3D Integrated Circuits. 

COVID-19 Impact Analysis

Due to the outbreak of the global pandemic, COVID-19 which has affected many industries all across the world causing impactful effects which is indirectly causing to impact the entire industry’s growth during the forecasted period. Since many local body governments have imposed lockdown restrictions on factories for the produce and manufacture of articles, the 3D ICs market is also negatively impacted. Like many other industries, the 3D ICs market is also substantially dependent on few ingredients and raw materials and it is possible to boost the overall production only with the help of cross-country trade and exchange of articles.

With reasons such as the improper movement, the mandatory shutdowns, it has caused a steep low in the sales of automotive and consumer electronics products, which has all caused a blow off in the demand for 3D ICs. Citing the above-mentioned reasons, it is very clear that the industry has taken a setback due to the outbreak of the virus.

Growth Factors

Certain factors such as spike in demand for smart devices and the dependency on sophisticated integrations, increase in the investment of the research and development activities, growing need and requirement of semiconductor industries, constant need for miniaturization of devices, changing market patterns and revolutionized customer approach can be sufficient growth drivers in the global 3D Integrated Circuits Market. Furthermore, with technological advancements, there is an increase in demand for high-bandwidth memory chips, increased efficiency and designs are all the more pressing factors that portray a promising picture for the global 3D integrated circuits market, in the upcoming years.

Report Scope:

Report Attribute Details
Base Year 2020
Historic Years 2016 - 2020
Forecast Years 2021 - 2028
Segments Covered By Product Type, By Application, and By End Use
Forecast Units Value (USD Billion), and Volume (Units)
Quantitative Units Revenue in USD million/billion and CAGR from 2021 to 2028
Regions Covered North America, Europe, Asia Pacific, Latin America, and Middle East & Africa, and Rest of World
Countries Covered U.S., Canada, Mexico, U.K., Germany, France, Italy, Spain, China, India, Japan, South Korea, Brazil, Argentina, GCC Countries, and South Africa, among others
Number of Companies Covered 10 companies with scope for including additional 15 companies upon request
Report Coverage Market growth drivers, restraints, opportunities, Porter’s five forces analysis, PEST analysis, value chain analysis, regulatory landscape, market attractiveness analysis by segments and region, company market share analysis, and COVID-19 impact analysis.
Customization Scope Avail customized purchase options to meet your exact research needs.

Product Type Segment Analysis Preview

On the basis of product type, the market can be divided into LED, Memories, MEMS, Sensor, Logic, and Others. However, it was found that the sensors segment held a significant market size in the overall product type segmentation market. Due to undeniable reasons like smaller form factors, impeccable efficiency and functionality, propelled performance, are the many hurdles in the development of sophisticated electronic products, including sensor inbuilt applications. Owing to its vast end user application, smart sensor and sensor interface products are held to be very useful in technologies instead of the traditional gold wire bonding.

Application Segment Analysis Preview

On the basis of the Application, the market has been bifurcated into Information and Communication Technology, Military, Consumer Electronics, Others. Consumer electronics had a slight edge over the other segments in the global 3D ICs market, holding the second-largest market share. Consumer electronic devices include many products such as digital cameras, smart televisions, smartphones, tablets, laptops, printers, among others. Whilst, Smart home devices further consist of a fan controller, smart smoke detector, energy monitors, door and window sensors, and doorbell, among others. Considerably after due deliberation, these smart home devices are viewed as intelligent security systems and are expected to grow immensely in the forthcoming years. Simply put, rising demand for durable consumer electronics products is the main reason for the spike in the demand for 3D ICs.

Regional Analysis Preview

In regional segmentation, the global coronavirus vaccines market is bifurcated into six key regions, namely, Europe, North America, Latin America, Asia Pacific, the Middle East, and Africa. Within these regional segments, the global 3D IC market is on the go by the Asia Pacific region. The market prospects in Asia-Pacific are predicted to be the leading region in the global market for the predicted upcoming years. The major drivers are the growing scope of the 3D IC packages in a variety of consumer electronic applications, especially smartphones and tablets. Owing to the forever rising population in the Asia Pacific segment, naturally the need and demand for sophisticated consumer electronics such as smartphones and tablets have also seen a hike. Moreover, the region is home to some of the biggest key players operating in the market. Hence, their competitive performance and efficiency are also aiding the growth of the regional market.

Key Market Players & Competitive Landscape

Some of the most vital market players are Samsung Electronics Co. Ltd., Toshiba Corporation, ASE Group, STMicroelectronics, Taiwan Semiconductor Manufacturing Co. Ltd., Intel Corporation, Broadcom Ltd., Amkor Technology, United Microelectronics Corporation, and Xilinx Inc., among others.

The global 3D IC market is segmented as follows:

By Product Type

  • LED
  • Memories
  • MEMS
  • Sensor
  • Logic
  • Others

By Substrate Type

  • Silicon on Insulator (SOI)
  • Bulk Silicon

By Application

  • Information and Communication Technology
  • Military
  • Consumer Electronics
  • Others

By Region

  • North America
    • The U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

Table Of Content

  • Chapter No. 1 Introduction
    • 1.1. Report Description
      • 1.1.1. Purpose of the Report
      • 1.1.2. USP & Key Offerings
    • 1.2. Key Benefits for Stakehulders
    • 1.3. Target Audience
    • 1.4. Report Scope
  • Chapter No. 2 Executive Summary
    • 2.1. Key Findings
      • 2.1.1. Top Investment Pockets
        • 2.1.1.1. Market Attractiveness Analysis, By Product Type
        • 2.1.1.2. Market Attractiveness Analysis, By Substrate Type
        • 2.1.1.3. Market Attractiveness Analysis, By Application
        • 2.1.1.4. Market Attractiveness Analysis, By Region
    • 2.2. Market Snapshot
    • 2.3. Global 3D IC Market, 2016 – 2028 (USD Billion)
    • 2.4. Insights from Primary Respondents
  • Chapter No. 3 COVID 19 Impact Analysis
    • 3.1. Impact Assessment of COVID-19 Pandemic, By Region
      • 3.1.1. North America
      • 3.1.2. Europe
      • 3.1.3. Asia Pacific
      • 3.1.4. Latin America
      • 3.1.5. The Middle-East and Africa
    • 3.2. Quarterly Market Revenue and Forecast by Region 2020 & 2021
    • 3.3. Pre COVID-19 Market Revenue, By Region, 2016-2019 (USD Billion)
    • 3.4. Post COVID-19 Market Revenue, By Region, 2020-2028 (USD Billion)
    • 3.5. Key Strategies Undertaken by Companies to Tackle COVID-19
      • 3.5.1. Company Quarterly Revenue Analysis, 2019 & 2020
    • 3.6. Short Term Dynamics
    • 3.7. Long Term Dynamics
  • Chapter No. 4 3D IC Market – Product Type Segment Analysis
    • 4.1. Overview
      • 4.1.1. Market Revenue Share, By Product Type, 2020 & 2028
    • 4.2. LED
      • 4.2.1. Market Size and Forecast, By Region (USD Billion)
      • 4.2.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.2.3. Key Market Trends, Growth Factors, & Opportunities
    • 4.3. Memories
      • 4.3.1. Market Size and Forecast, By Region (USD Billion)
      • 4.3.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.3.3. Key Market Trends, Growth Factors, & Opportunities
    • 4.4. MEMS
      • 4.4.1. Market Size and Forecast, By Region (USD Billion)
      • 4.4.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.4.3. Key Market Trends, Growth Factors, & Opportunities
    • 4.5. Sensor
      • 4.5.1. Market Size and Forecast, By Region (USD Billion)
      • 4.5.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.5.3. Key Market Trends, Growth Factors, & Opportunities
    • 4.6. Logic
      • 4.6.1. Market Size and Forecast, By Region (USD Billion)
      • 4.6.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.6.3. Key Market Trends, Growth Factors, & Opportunities
    • 4.7. Others
      • 4.7.1. Market Size and Forecast, By Region (USD Billion)
      • 4.7.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 4.7.3. Key Market Trends, Growth Factors, & Opportunities
  • Chapter No. 5 3D IC Market – Substrate Type Segment Analysis
    • 5.1. Overview
      • 5.1.1. Market Revenue Share, By Substrate Type, 2020 & 2028
    • 5.2. Silicon on Insulator (SOI)
      • 5.2.1. Market Size and Forecast, By Region (USD Billion)
      • 5.2.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 5.2.3. Key Market Trends, Growth Factors, & Opportunities
    • 5.3. Bulk Silicon
      • 5.3.1. Market Size and Forecast, By Region (USD Billion)
      • 5.3.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 5.3.3. Key Market Trends, Growth Factors, & Opportunities
  • Chapter No. 6 3D IC Market – Application Segment Analysis
    • 6.1. Overview
      • 6.1.1. Market Revenue Share, By Application, 2020 & 2028
    • 6.2. Information and Communication Technology
      • 6.2.1. Market Size and Forecast, By Region (USD Billion)
      • 6.2.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 6.2.3. Key Market Trends, Growth Factors, & Opportunities
    • 6.3. Military
      • 6.3.1. Market Size and Forecast, By Region (USD Billion)
      • 6.3.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 6.3.3. Key Market Trends, Growth Factors, & Opportunities
    • 6.4. Consumer Electronics
      • 6.4.1. Market Size and Forecast, By Region (USD Billion)
      • 6.4.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 6.4.3. Key Market Trends, Growth Factors, & Opportunities
    • 6.5. Others
      • 6.5.1. Market Size and Forecast, By Region (USD Billion)
      • 6.5.2. Comparative Revenue Analysis, By Country, 2020 & 2028
      • 6.5.3. Key Market Trends, Growth Factors, & Opportunities
  • Chapter No. 7 3D IC Market – Regional Analysis
    • 7.1. Overview
      • 7.1.1. Global Market Revenue Share, By Region, 2020 & 2028
      • 7.1.2. Global Market Revenue, By Region, 2016 – 2028 (USD Billion)
    • 7.2. North America
      • 7.2.1. North America Market Revenue, By Country, 2016 – 2028 (USD Billion)
      • 7.2.2. North America Market Revenue, By Product Type, 2016 – 2028
      • 7.2.3. North America Market Revenue, By Substrate Type, 2016 – 2028
      • 7.2.4. North America Market Revenue, By Application, 2016 – 2028
      • 7.2.5. U.S.
        • 7.2.5.1. U.S. Market Revenue, By Product Type, 2016 – 2028
        • 7.2.5.2. U.S. Market Revenue, By Substrate Type, 2016 – 2028
        • 7.2.5.3. U.S. Market Revenue, By Application, 2016 – 2028
      • 7.2.6. Canada
        • 7.2.6.1. Canada Market Revenue, By Product Type, 2016 – 2028
        • 7.2.6.2. Canada Market Revenue, By Substrate Type, 2016 – 2028
        • 7.2.6.3. Canada Market Revenue, By Application, 2016 – 2028
      • 7.2.7. Mexico
        • 7.2.7.1. Mexico Market Revenue, By Product Type, 2016 – 2028
        • 7.2.7.2. Mexico Market Revenue, By Substrate Type, 2016 – 2028
        • 7.2.7.3. Mexico Market Revenue, By Application, 2016 – 2028
    • 7.3. Europe
      • 7.3.1. Europe Market Revenue, By Country, 2016 – 2028 (USD Billion)
      • 7.3.2. Europe Market Revenue, By Product Type, 2016 – 2028
      • 7.3.3. Europe Market Revenue, By Substrate Type, 2016 – 2028
      • 7.3.4. Europe Market Revenue, By Application, 2016 – 2028
      • 7.3.5. Germany
        • 7.3.5.1. Germany Market Revenue, By Product Type, 2016 – 2028
        • 7.3.5.2. Germany Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.5.3. Germany Market Revenue, By Application, 2016 – 2028
      • 7.3.6. France
        • 7.3.6.1. France Market Revenue, By Product Type, 2016 – 2028
        • 7.3.6.2. France Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.6.3. France Market Revenue, By Application, 2016 – 2028
      • 7.3.7. U.K.
        • 7.3.7.1. U.K. Market Revenue, By Product Type, 2016 – 2028
        • 7.3.7.2. U.K. Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.7.3. U.K. Market Revenue, By Application, 2016 – 2028
      • 7.3.8. Italy
        • 7.3.8.1. Italy Market Revenue, By Product Type, 2016 – 2028
        • 7.3.8.2. Italy Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.8.3. Italy Market Revenue, By Application, 2016 – 2028
      • 7.3.9. Spain
        • 7.3.9.1. Spain Market Revenue, By Product Type, 2016 – 2028
        • 7.3.9.2. Spain Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.9.3. Spain Market Revenue, By Application, 2016 – 2028
      • 7.3.10. Rest of Europe
        • 7.3.10.1. Rest of Europe Market Revenue, By Product Type, 2016 – 2028
        • 7.3.10.2. Rest of Europe Market Revenue, By Substrate Type, 2016 – 2028
        • 7.3.10.3. Rest of Europe Market Revenue, By Application, 2016 – 2028
    • 7.4. Asia Pacific
      • 7.4.1. Asia Pacific Market Revenue, By Country, 2016 – 2028 (USD Billion)
      • 7.4.2. Asia Pacific Market Revenue, By Product Type, 2016 – 2028
      • 7.4.3. Asia Pacific Market Revenue, By Substrate Type, 2016 – 2028
      • 7.4.4. Asia Pacific Market Revenue, By Application, 2016 – 2028
      • 7.4.5. China
        • 7.4.5.1. China Market Revenue, By Product Type, 2016 – 2028
        • 7.4.5.2. China Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.5.3. China Market Revenue, By Application, 2016 – 2028
      • 7.4.6. Japan
        • 7.4.6.1. Japan Market Revenue, By Product Type, 2016 – 2028
        • 7.4.6.2. Japan Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.6.3. Japan Market Revenue, By Application, 2016 – 2028
      • 7.4.7. India
        • 7.4.7.1. India Market Revenue, By Product Type, 2016 – 2028
        • 7.4.7.2. India Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.7.3. India Market Revenue, By Application, 2016 – 2028
      • 7.4.8. South Korea
        • 7.4.8.1. South Korea Market Revenue, By Product Type, 2016 – 2028
        • 7.4.8.2. South Korea Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.8.3. South Korea Market Revenue, By Application, 2016 – 2028
      • 7.4.9. South-East Asia
        • 7.4.9.1. South-East Asia Market Revenue, By Product Type, 2016 – 2028
        • 7.4.9.2. South-East Asia Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.9.3. South-East Asia Market Revenue, By Application, 2016 – 2028
      • 7.4.10. Rest of Asia Pacific
        • 7.4.10.1. Rest of Asia Pacific Market Revenue, By Product Type, 2016 – 2028
        • 7.4.10.2. Rest of Asia Pacific Market Revenue, By Substrate Type, 2016 – 2028
        • 7.4.10.3. Rest of Asia Pacific Market Revenue, By Application, 2016 – 2028
    • 7.5. Latin America
      • 7.5.1. Latin America Market Revenue, By Country, 2016 – 2028 (USD Billion)
      • 7.5.2. Latin America Market Revenue, By Product Type, 2016 – 2028
      • 7.5.3. Latin America Market Revenue, By Substrate Type, 2016 – 2028
      • 7.5.4. Latin America Market Revenue, By Application, 2016 – 2028
      • 7.5.5. Brazil
        • 7.5.5.1. Brazil Market Revenue, By Product Type, 2016 – 2028
        • 7.5.5.2. Brazil Market Revenue, By Substrate Type, 2016 – 2028
        • 7.5.5.3. Brazil Market Revenue, By Application, 2016 – 2028
      • 7.5.6. Argentina
        • 7.5.6.1. Argentina Market Revenue, By Product Type, 2016 – 2028
        • 7.5.6.2. Argentina Market Revenue, By Substrate Type, 2016 – 2028
        • 7.5.6.3. Argentina Market Revenue, By Application, 2016 – 2028
      • 7.5.7. Rest of Latin America
        • 7.5.7.1. Rest of Latin America Market Revenue, By Product Type, 2016 – 2028
        • 7.5.7.2. Rest of Latin America Market Revenue, By Substrate Type, 2016 – 2028
        • 7.5.7.3. Rest of Latin America Market Revenue, By Application, 2016 – 2028
    • 7.6. The Middle-East and Africa
      • 7.6.1. The Middle-East and Africa Market Revenue, By Country, 2016 – 2028 (USD Billion)
      • 7.6.2. The Middle-East and Africa Market Revenue, By Product Type, 2016 – 2028
      • 7.6.3. The Middle-East and Africa Market Revenue, By Substrate Type, 2016 – 2028
      • 7.6.4. The Middle-East and Africa Market Revenue, By Application, 2016 – 2028
      • 7.6.5. GCC Countries
        • 7.6.5.1. GCC Countries Market Revenue, By Product Type, 2016 – 2028
        • 7.6.5.2. GCC Countries Market Revenue, By Substrate Type, 2016 – 2028
        • 7.6.5.3. GCC Countries Market Revenue, By Application, 2016 – 2028
      • 7.6.6. South Africa
        • 7.6.6.1. South Africa Market Revenue, By Product Type, 2016 – 2028
        • 7.6.6.2. South Africa Market Revenue, By Substrate Type, 2016 – 2028
        • 7.6.6.3. South Africa Market Revenue, By Application, 2016 – 2028
      • 7.6.7. Rest of Middle-East Africa
        • 7.6.7.1. Rest of Middle-East Africa Market Revenue, By Product Type, 2016 – 2028
        • 7.6.7.2. Rest of Middle-East Africa Market Revenue, By Substrate Type, 2016 – 2028
        • 7.6.7.3. Rest of Middle-East Africa Market Revenue, By Application, 2016 – 2028
  • Chapter No. 8 3D IC Market – Industry Analysis
    • 8.1. Introduction
    • 8.2. Market Drivers
      • 8.2.1. Driving Factor 1 Analysis
      • 8.2.2. Driving Factor 2 Analysis
    • 8.3. Market Restraints
      • 8.3.1. Restraining Factor Analysis
    • 8.4. Market Opportunities
      • 8.4.1. Market Opportunity Analysis
    • 8.5. Porter’s Five Forces Analysis
    • 8.6. PEST Analysis
    • 8.7. Regulatory Landscape
    • 8.8. Technology Landscape
    • 8.9. Regional Market Trends
      • 8.9.1. North America
      • 8.9.2. Europe
      • 8.9.3. Asia Pacific
      • 8.9.4. Latin America
      • 8.9.5. The Middle-East and Africa
    • 8.10. Pricing Analysis
    • 8.11. Value Chain Analysis
    • 8.12. Downstream Buyers
    • 8.13. Distributors/Traders List
  • Chapter No. 9 Competitive Landscape
    • 9.1. Company Market Share Analysis – 2019
      • 9.1.1. Global 3D IC Market: Company Market Share, 2019
      • 9.1.2. Global 3D IC Market, Company Market Revenue, 2016 – 2019 (USD Billion)
      • 9.1.3. Global 3D IC Market, Company Y-o-Y Growth, 2017 – 2019 (%)
      • 9.1.4. Global 3D IC Market: Radar Determinant Chart, 2019
    • 9.2. Strategic Developments
      • 9.2.1. Acquisitions & Mergers
      • 9.2.2. New Product Launch
      • 9.2.3. Regional Expansion
    • 9.3. Company Strategic Developments – Heat Map Analysis
  • Chapter No. 10 Company Profiles
    • 10.1. Emerson Electric Co
      • 10.1.1. Company Overview
      • 10.1.2. Key Executives
      • 10.1.3. Product Portfolio
      • 10.1.4. Financial Overview
      • 10.1.5. Operating Business Segments
      • 10.1.6. Business Performance
      • 10.1.7. Recent Developments
    • 10.2. Hunter Fan
    • 10.3. Crompton Greaves
    • 10.4. Shell Electric MFG Co Ltd
    • 10.5. NuTone
    • 10.6. bajaj
    • 10.7. Craftmade Fans
    • 10.8. Monte Carlo Fans
    • 10.9. Quorum Fans
    • 10.10. Kicher Fans
  • Chapter No. 11 Marketing Strategy Analysis
    • 11.1. Marketing Channel
    • 11.2. Direct Marketing
    • 11.3. Indirect Marketing
    • 11.4. Marketing Channel Development Trends
    • 11.5. Economic/Pulitical Environmental Change
  • Chapter No. 12 Research Methodology
    • 12.1. Research Methodology
    • 12.2. Phase I - Secondary Research
    • 12.3. Phase II - Data Modeling
      • 12.3.1. Company Share Analysis Model
      • 12.3.2. Revenue Based Modeling
    • 12.4. Phase III - Primary Research
    • 12.5. Research Limitations
      • 12.5.1. Assumptions

Table Of Figures

List of Figures 

FIG NO. 1. Market Attractiveness Analysis, By Product Type
FIG NO. 2. Market Attractiveness Analysis, By Substrate Type
FIG NO. 3. Market Attractiveness Analysis, By Application
FIG NO. 4. Market Attractiveness Analysis, By Region
FIG NO. 5. Global 3D IC Market Revenue, 2016 – 2028 (USD Billion)
FIG NO. 6. Impact of COVID-19 Pandemic in North America Countries
FIG NO. 7. Market Revenue Share, By Product Type, 2020 & 2028
FIG NO. 8. Global 3D IC Market for LED, Revenue (USD Billion) 2016 – 2028
FIG NO. 9. Comparative Revenue Analysis of 3D IC Market for LED, By Country, 2020 & 2028
FIG NO. 10. Global 3D IC Market for Memories, Revenue (USD Billion) 2016 – 2028
FIG NO. 11. Comparative Revenue Analysis of 3D IC Market for Memories, By Country, 2020 & 2028
FIG NO. 12. Global 3D IC Market for MEMS, Revenue (USD Billion) 2016 – 2028
FIG NO. 13. Comparative Revenue Analysis of 3D IC Market for MEMS, By Country, 2020 & 2028
FIG NO. 14. Global 3D IC Market for Sensor, Revenue (USD Billion) 2016 – 2028
FIG NO. 15. Comparative Revenue Analysis of 3D IC Market for Sensor, By Country, 2020 & 2028
FIG NO. 16. Market Revenue Share, By Substrate Type, 2020 & 2028
FIG NO. 17. Global 3D IC Market for Silicon on Insulator (SOI), Revenue (USD Billion) 2016 – 2028
FIG NO. 18. Comparative Revenue Analysis of 3D IC Market for Silicon on Insulator (SOI), By Country, 2020 & 2028
FIG NO. 19. Global 3D IC Market for Bulk Silicon, Revenue (USD Billion) 2016 – 2028
FIG NO. 20. Comparative Revenue Analysis of 3D IC Market for Bulk Silicon, By Country, 2020 & 2028
FIG NO. 21. Global 3D IC Market for Large, Revenue (USD Billion) 2016 – 2028
FIG NO. 22. Comparative Revenue Analysis of 3D IC Market for Large, By Country, 2020 & 2028
FIG NO. 23. Market Revenue Share, By Application, 2020 & 2028
FIG NO. 24. Global 3D IC Market for Information and Communication Technology, Revenue (USD Billion) 2016 – 2028
FIG NO. 25. Comparative Revenue Analysis of 3D IC Market for Information and Communication Technology, By Country, 2020 & 2028
FIG NO. 26. Global 3D IC Market for Military, Revenue (USD Billion) 2016 – 2028
FIG NO. 27. Comparative Revenue Analysis of 3D IC Market for Military, By Country, 2020 & 2028
FIG NO. 28. Global 3D IC Market for Sensor, Revenue (USD Billion) 2016 – 2028
FIG NO. 29. Comparative Revenue Analysis of 3D IC Market for Sensor, By Country, 2020 & 2028
FIG NO. 30. Global 3D IC Market Revenue Share, By Region, 2020 & 2028
FIG NO. 31. North America 3D IC Market Revenue, 2016 - 2028 (USD Billion)
FIG NO. 32. Porter’s Five Forces Analysis for Global 3D IC Market
FIG NO. 33. PEST Analysis for Global 3D IC Market
FIG NO. 34. Pricing Analysis for Global 3D IC Market
FIG NO. 35. Value Chain Analysis for Global 3D IC Market
FIG NO. 36. Company Share Analysis, 2019
FIG NO. 37. Radar Determinant Chart, 2019
FIG NO. 38. Company Strategic Developments – Heat Map Analysis
FIG NO. 39. Emerson Electric Co Business Segment Revenue Share, 2020 (%)
FIG NO. 40. Emerson Electric Co Geographical Segment Revenue Share, 2020 (%)
FIG NO. 41. Market Channels
FIG NO. 42. Marketing Channel Development Trend
FIG NO. 43. Growth in World Gross Product, 2008-2018
FIG NO. 44. Research Methodology – Detailed View
FIG NO. 45. Research Methodology


Table Of Tables

List of Tables 

TABLE NO. 1. Global 3D IC Market: Snapshot
TABLE NO. 2. Quarterly 3D IC Market Revenue by Region, 2020
TABLE NO. 3. Quarterly 3D IC Market Revenue Forecast by Region, 2021
TABLE NO. 4. Pre COVID-19 Market Revenue, By Region, 2016-2019 (USD Billion)
TABLE NO. 5. Post COVID-19 Market Revenue, By Region, 2020-2028 (USD Billion)
TABLE NO. 6. Global 3D IC Market for LED, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 7. Global 3D IC Market for Memories, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 8. Global 3D IC Market for MEMS, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 9. Global 3D IC Market for Sensor, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 10. Global 3D IC Market for Silicon on Insulator (SOI), by Region, 2016 – 2028 (USD Billion)
TABLE NO. 11. Global 3D IC Market for Bulk Silicon, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 12. Global 3D IC Market for Large, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 13. Global 3D IC Market for Information and Communication Technology, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 14. Global 3D IC Market for Military, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 15. Global 3D IC Market for Sensor, by Region, 2016 – 2028 (USD Billion)
TABLE NO. 16. Global 3D IC Market Revenue, By Region, 2016 – 2028 (USD Billion)
TABLE NO. 17. North America 3D IC Market Revenue, By Country, 2016 – 2028 (USD Billion)
TABLE NO. 18. North America 3D IC Market Revenue, By Product Type, 2016 – 2028 (USD Billion)
TABLE NO. 19. North America 3D IC Market Revenue, By Substrate Type, 2016 – 2028 (USD Billion)
TABLE NO. 20. North America 3D IC Market Revenue, By Application, 2016 – 2028 (USD Billion)
TABLE NO. 21. U.S. 3D IC Market Revenue, By Product Type, 2016 – 2028 (USD Billion)
TABLE NO. 22. U.S. 3D IC Market Revenue, By Substrate Type, 2016 – 2028 (USD Billion)
TABLE NO. 23. U.S. 3D IC Market Revenue, By Application, 2016 – 2028 (USD Billion)
TABLE NO. 24. Canada 3D IC Market Revenue, By Product Type, 2016 – 2028 (USD Billion)
TABLE NO. 25. Canada 3D IC Market Revenue, By Substrate Type, 2016 – 2028 (USD Billion)
TABLE NO. 26. Canada 3D IC Market Revenue, By Application, 2016 – 2028 (USD Billion)
TABLE NO. 27. Mexico 3D IC Market Revenue, By Product Type, 2016 – 2028 (USD Billion)
TABLE NO. 28. Mexico 3D IC Market Revenue, By Substrate Type, 2016 – 2028 (USD Billion)
TABLE NO. 29. Mexico 3D IC Market Revenue, By Application, 2016 – 2028 (USD Billion)
TABLE NO. 30. Drivers for the 3D IC Market: Impact Analysis
TABLE NO. 31. Restraints for the 3D IC Market: Impact Analysis
TABLE NO. 32. Major Buyers of 3D IC
TABLE NO. 33. Distributors/Traders List of 3D IC
TABLE NO. 34. Global 3D IC Market, Company Market Revenue, 2016 – 2019 (USD Billion)
TABLE NO. 35. Global 3D IC Market, Company Y-o-Y Growth, 2017 – 2019 (USD Billion)
 

Methodology

This report is based on in-depth qualitative and quantitative analyses of the global 3D IC market. Zion Research has collected and analyzed key data belong to the global 3D IC market using a variety of methods. Quantitative analysis has been done following various projection and sampling techniques.

The qualitative analysis involved primary interviews, surveys, and vendor briefings. The data gathered as a result of these processes were validated through experts' opinions. The market dynamics have been determined after conducting a detailed study of the micro and macroeconomic indicators of the market.

Various parameters have been taken into account, while estimating market size. The revenue generated by the leading industry participants in from the sales of 3D IC across the world has been calculated through primary and secondary research.

Zion Research employs the combination of secondary research followed by extensive primary research. Under secondary research, we refer to prominent paid as well as open access data sources including product literature, company annual reports, government publications, press releases, industry association’s magazines and other relevant sources for data collection. Other prominent secondary sources include STATISTA, trade journals, trade associations, statistical data from government websites, etc. 

For this study, Zion Research has conducted all-encompassing primary research with key industry participants to collect first had data. Moreover, in-depth interviews with key opinion leaders also assisted in validation of findings from secondary research and to understand key trends in the 3D IC industry. Primary research makes up the major source of data collection and validation.   

Primary Research

We conduct primary interviews with industry participants and commentators on an ongoing basis to validate data and analysis. A typical research interview fulfills the following functions:

  • Provides firsthand information on market size, market trends, growth trends, competitive landscape, outlook, etc.
  • Helps in validating and strengthening the secondary research findings
  • Further, develops the analysis team’s expertise and market understanding
  • Primary research involves e-mail interactions, telephonic interviews as well as face-to-face interviews for each market, category, segment and sub-segment across geographies

Participants who typically participate in such a process include, but are not limited to:

  • Industry participants: CEOs, VPs, marketing/product managers, market intelligence managers and national sales managers
  • Purchasing managers, technical personnel, distributors and resellers
  • Outside experts: Investment bankers, valuation experts and research analysts specializing in specific markets

Key opinion leaders specializing in different areas corresponding to different industry verticals

Secondary Research

Secondary research sources that are typically referred to include, but are not limited to:

  • Company websites, annual reports, financial reports, broker reports, investor presentations and SEC filings
  • IDC and other relevant magazines
  • Internal and external proprietary databases, and relevant patent and regulatory databases
  • National government documents, statistical databases and market reports

News articles, press releases and webcasts specific to companies operating in the market

Following a comprehensive secondary and primary research and insights thus gathered, analysts at Zion Research have provided an in-depth analysis of various aspects of the 3D IC market.

Models

Where no hard data is available, we use models and estimates to produce comprehensive data sets. A rigorous methodology is adopted, wherein the available hard data is cross-referenced with the following data types to produce estimates:

  • Demographic data: Population split by segments
  • Macroeconomic indicators: GDP, PPP, Per Capita Income, etc.
  • Industry indicators: Expenditure, technology stage and infrastructure, sector growth and facilities
  • Data is then cross-checked by an expert panel.

Free Analysis

Integrated circuit (IC) also called as chip or microchip is a semiconductor wafer on which thousands or millions of tiny resistors, capacitors, and transistors are fabricated. An IC can function as an oscillator, timer, amplifier, counter, computer memory, or microprocessor. In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies. 3D IC mainly used in information and communication technology, military and consumer electronics industry.

Global 3D IC market is expected to witness a significant growth over the forecast period owing to growing demand of compact and high-performance IC in end-use industries.  Increasing demand for solutions with improved performance and reduced response time and demand from consumer electronics and ICT are also anticipated to drive the 3D IC market over the forecast period. Furthermore, increasing number of portable devices such as smartphone, tablets or laptops are some of the major factors to drive adoption of 3D ICs near future. However, high cost and thermal conductivity & testing issues may pose a challenge to the market growth.

/Global-3D-IC-Market

Based on product, 3D IC market has been segmented into LED, memories, MEMS & sensor, logic and others. 3D IC market was dominated by memories and MEMS & sensor segment and is expected to continue its dominance in the global market over the estimated period. LED is another key outlet for this market in 2016 and is expected to grow at a moderate rate due to rising adoption of LED products as it saves power consumption and offers efficiency.

3D IC market can be segmented based on the substrate into silicon on insulator (SOI) and bulk silicon. This market was dominated by silicon on insulator (SOI) segment in 2016 with substantial market share. Further, it is expected to continue its dominance in the global market over the forecast period. Bulk silicon segment is expected to exhibit considerable growth in the next few years.  Wafer bonding is the leading fabrication process segment in this market. It is broadly used because it bonds the component without many complexities and reduces the size of the integrated chip and power consumption.

Some of the key applications of the 3D IC include information and communication technology, military, consumer electronics and others. Information and communication technology application segment held the largest market share for the 3D IC in 2016. This segment accounted for 26% market share of the total market. It is followed by consumer electronics and military segments. Consumer electronics is another key outlet of the market and is likely to grow with consistent rate due to rising demand for consumer electronics products with smaller size and enhanced performance.

In term of revenue, Asia Pacific emerged as one of the largest markets for 3D IC in 2016 and accounted for over 40% share of the total market. Some factors such as the stable economy and growing demand for consumer electronics devices will drive the growth of the 3D IC market in this region. North America is expected to witness robust growth during the forecast period. Europe is also expected to grow at significant rate in the years to come.

Some of the key players in the global 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, United Microelectronics Corporation, and STMicroelectronics amongst others.

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FrequentlyAsked Questions

The global 3D IC market was valued at USD 9.76 Billion in 2020.

The global 3D IC market is expected to reach USD 23.80 Billion by 2028, growing at a CAGR of 20.45% between 2021 to 2028.

Certain factors such as spike in demand for smart devices and the dependency on sophisticated integrations, increase in the investment of the research and development activities, growing need and requirement of semiconductor industries, constant need for miniaturization of devices, changing market patterns and revolutionized customer approach can be sufficient growth drivers in the global 3D Integrated Circuits Market. Furthermore, with technological advancements, there is an increase in demand for high-bandwidth memory chips, increased efficiency and designs are all the more pressing factors that portray a promising picture for the global 3D integrated circuits market, in the upcoming years. 

In regional segmentation, the global coronavirus vaccines market is bifurcated into six key regions, namely, Europe, North America, Latin America, Asia Pacific, the Middle East, and Africa. Within these regional segments, the global 3D IC market is on the go by the Asia Pacific region. The market prospects in Asia-Pacific are predicted to be the leading region in the global market for the predicted upcoming years. The major drivers are the growing scope of the 3D IC packages in a variety of consumer electronic applications, especially smartphones and tablets. Owing to the forever rising population in the Asia Pacific segment, naturally the need and demand for sophisticated consumer electronics such as smartphones and tablets have also seen a hike. Moreover, the region is home to some of the biggest key players operating in the market. Hence, their competitive performance and efficiency are also aiding the growth of the regional market.

Some of the most vital market players are Samsung Electronics Co. Ltd., Toshiba Corporation, ASE Group, STMicroelectronics, Taiwan Semiconductor Manufacturing Co. Ltd., Intel Corporation, Broadcom Ltd., Amkor Technology, United Microelectronics Corporation, and Xilinx Inc., among others.

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